APTCV60TLM24T3G

Overview

The APTCV60TLM24T3G is a three-level inverter IGBT module manufactured by Microchip Technology. It features a 600V collector-emitter breakdown voltage and a continuous collector current of 70A at 25°C, with a maximum repetitive peak current (Idm) of 260A. The device utilizes Trench Field Stop technology and is housed in an SP3F press-in package. Electrical characteristics include a forward current rating of 60A for the integrated diode, with rise times specified at 30ns and 45ns. The component operates within a standard temperature range typical for power electronics.

Feature Summary

• Utilizes Trench Field Stop IGBT technology for optimized switching performance
• Designed specifically for three-level inverter configurations
• Features SP3F press-in mounting package for secure PCB integration

Applications

• Three-level inverter circuits
• Industrial motor drives
• Uninterruptible power supplies

Procurement Notes

Verify the specific datasheet version and electrical test conditions prior to procurement. Confirm that the SP3F press-in package requirements match the target PCB footprint and assembly equipment capabilities. Ensure thermal management solutions are compatible with the module's power dissipation specifications. Cross-reference the manufacturer's latest product change notifications to confirm component status and availability constraints.

Selection Notes

Select this component when designing three-level inverter topologies requiring 600V blocking capability. The SP3F press-in package necessitates specific mechanical retention strategies distinct from screw-mount alternatives. Evaluate the 70A continuous current rating against system load requirements. Consider the 30ns/45ns rise times for electromagnetic interference analysis and gate driver design compatibility.

Part Context

This part belongs to Microchip's portfolio of high-performance power modules. It integrates IGBTs and diodes into a single unitized structure. The SP3F package represents a specific form factor designed for press-in installation methods. This configuration supports compact power electronic designs compared to traditional discrete assemblies.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify pinout and thermal interface compatibility if considering alternative manufacturers or different package types within the same voltage class.