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APTDF200KK60D16AG
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Product Detailed Parameters
- Description：DIODE MODULE GEN PURP 600V 460A
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- Diode Configuration：1 Pair Common Cathode
- Technology：Standard
- Voltage - DC Reverse (Vr) (Max)：600 V
- Current - Average Rectified (Io) (per Diode)：460A
- Voltage - Forward (Vf) (Max) @ If：2.5 V @ 200 A
- Speed：Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr)：160 ns
- Current - Reverse Leakage @ Vr：50 µA @ 600 V
- Operating Temperature - Junction：-40°C ~ 175°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：-
- Grade：-
- Qualification：-
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Overview
The APTDF200KK60D16AG is a 600V, 200A fast diode common-cathode power module. It features an M6 screw mount package with an Aluminum Nitride substrate for low thermal resistance (0.15 °C/W). The device supports a peak repetitive reverse voltage of 600V and a DC forward current of 460A at 25°C case temperature. Operating junction temperature ranges from -40°C to 175°C. Electrical characteristics include a maximum forward voltage of 2.5V at 200A and a typical reverse recovery time of 160ns at 25°C.
Feature Summary
- Soft-recovery characteristics for low-noise switching
- Aluminum Nitride substrate for improved thermal performance
- Direct mounting to heatsink with isolated package design
Applications
- Uninterruptible Power Supply (UPS)
- Induction heating
- Welding equipment
- High-speed rectifiers
Procurement Notes
Verify the specific ordering suffix D16AG against official Microchip documentation to confirm exact pinout and terminal configuration. Ensure handling procedures account for electrostatic discharge sensitivity. Confirm that the M6 mounting torque specifications align with the mechanical constraints of the target application assembly.
Selection Notes
Select this component when high-frequency operation and low switching losses are required. The common-cathode configuration simplifies circuit topology compared to discrete setups. Evaluate the thermal impedance curves to ensure adequate heatsinking for the intended duty cycle and ambient conditions within the specified operating temperature range.
Part Context
This device belongs to the Adaptec family of silicon diode modules manufactured by Microchip Technology. It utilizes standard silicon technology optimized for high-power industrial applications. The module integrates multiple die configurations into a single robust package designed for reliable performance in demanding electrical environments.
Replacement Considerations
Consult official Microchip substitution guides for verified equivalent part numbers. Do not assume compatibility based solely on voltage and current ratings; verify pinout, thermal resistance, and dynamic characteristics against the original design requirements.
