APTDF400AK60G

$115.43

Description：DIODE MODULE GP 600V 500A SP6
Series：-

SKU:3633f266ab6b Category: Diode Arrays Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：DIODE MODULE GP 600V 500A SP6
Series：-
Mfr：Microchip Technology
Package：Bulk
Diode Configuration：1 Pair Series Connection
Technology：Standard
Voltage - DC Reverse (Vr) (Max)：600 V
Current - Average Rectified (Io) (per Diode)：500A
Voltage - Forward (Vf) (Max) @ If：2 V @ 400 A
Speed：Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)：160 ns
Current - Reverse Leakage @ Vr：750 µA @ 600 V
Operating Temperature - Junction：-
Mounting Type：Chassis Mount
Package / Case：LP4
Supplier Device Package：SP6
Grade：-
Qualification：-

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APTDF400AK60G

Overview

The APTDF400AK60G is a silicon rectifier diode module manufactured by Microchip Technology. It features a single diode configuration housed in an SP6 package with screw mount installation. The device supports a maximum repetitive reverse voltage of 600V and an average forward current of 500A per element. The forward voltage is specified at 1.8V when tested at 400A. The module operates within a temperature range of -40°C to +150°C.

Feature Summary

Single diode configuration for high-current applications
SP6 package design for robust screw mount installation
Silicon construction optimized for power rectification

Applications

Industrial power supply systems
Motor drive rectification circuits
General purpose high current rectification

Procurement Notes

Verify the specific suffix against official datasheets to confirm exact electrical ratings and pinout compatibility. Ensure thermal management solutions match the SP6 package requirements. Confirm RoHS compliance status through manufacturer documentation before integration into regulated equipment designs.

Selection Notes

Select this component for applications requiring a single high-current rectifier path. Compare the 600V rating and 500A current capacity against circuit demands. Consider the SP6 package dimensions for board layout constraints. Evaluate thermal resistance characteristics relative to the intended heat sink interface.

Part Context

This part belongs to the APTDF series of discrete power diodes from Microchip Technology. The series utilizes silicon technology for reliable performance in demanding power electronics environments. The SP6 package provides a standardized form factor for mounting on heatsinks in industrial power modules.