APTDX300A120D16AG

$98.18

Description：DIODE MODULE GEN PURP 1200V 485A
Series：-

SKU:dd72b96124f7 Category: Diode Arrays Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：DIODE MODULE GEN PURP 1200V 485A
Series：-
Mfr：Microchip Technology
Package：Bulk
Diode Configuration：1 Pair Series Connection
Technology：Standard
Voltage - DC Reverse (Vr) (Max)：1200 V
Current - Average Rectified (Io) (per Diode)：485A
Voltage - Forward (Vf) (Max) @ If：2 V @ 300 A
Speed：Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr)：-
Current - Reverse Leakage @ Vr：20 µA @ 1200 V
Operating Temperature - Junction：-40°C ~ 175°C
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：-
Grade：-
Qualification：-

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APTDX300A120D16AG

Overview

The APTDX300A120D16AG is a 1200V, 300A fast diode phase-leg power module. It features an M6 screw mount configuration with an aluminum nitride substrate for improved thermal performance. The device provides a peak repetitive reverse voltage of 1200V and supports a DC forward current of up to 485A at 25°C case temperature. Electrical characteristics include a maximum forward voltage of 2V at 300A and 25°C junction temperature. Reverse leakage current is limited to 20μA at 1200V. The module operates within a junction temperature range of -40°C to 175°C.

Feature Summary

Soft-recovery characteristics for low-noise switching
Aluminum Nitride substrate for improved thermal performance
Direct mounting to heatsink via isolated package design

Applications

Uninterruptible Power Supply (UPS)
Induction heating
Welding equipment
High-speed rectifiers

Procurement Notes

Verify the specific datasheet revision DS00005303A against your design requirements. Confirm that the M6 mounting torque specifications align with your mechanical assembly guidelines. Ensure electrostatic discharge handling procedures are strictly followed during installation due to component sensitivity. Cross-reference the isolation voltage ratings with your system's safety standards before finalizing procurement.

Selection Notes

Select this module when high blocking voltage and significant current capacity are required in a phase-leg configuration. The aluminum nitride substrate makes it suitable for applications demanding efficient heat dissipation. Evaluate the soft-recovery traits if minimizing switching noise is critical. Verify that the operating temperature range meets the environmental conditions of the intended deployment site.

Part Context

This component belongs to Microchip Technology's Adaptec power module portfolio. It utilizes silicon technology optimized for high-power industrial applications. The D1 package outline defines its physical dimensions and terminal layout. The product is designed to integrate directly into power conversion systems requiring robust diode protection and rectification capabilities.