APTGF180SK60TG

$38.05

Description：IGBT MODULE 600V 220A 833W SP4
Series：-

SKU:20ffa68f1a6f Category: IGBT Modules Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 600V 220A 833W SP4
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：NPT
Configuration：Single
Vce(on) (Max) @ Vge, Ic：2.5V @ 15V, 180A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-
Mounting Type：Chassis Mount
Package / Case：SP4
Supplier Device Package：SP4
Voltage - Collector Emitter Breakdown (Max)：600 V
Current - Collector (Ic) (Max)：220 A
Power - Max：833 W
Current - Collector Cutoff (Max)：300 µA
Input Capacitance (Cies) @ Vce：8.6 nF @ 25 V

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APTGF180SK60TG

Overview

The APTGF180SK60TG is a non-punch-through (NPT) fast IGBT power module manufactured by Microchip Technology. It features a single configuration with a collector-emitter breakdown voltage of 600 V and a continuous collector current rating of 180 A at Tc = 80°C. The device supports a pulsed collector current of 630 A and has a maximum power dissipation of 833 W. It utilizes an SP4 isolated package with screw mounting, includes an internal NTC thermistor for temperature monitoring, and operates within a junction temperature range of -40°C to 150°C.

Feature Summary

Non-Punch-Through (NPT) Fast IGBT technology providing low voltage drop and low tail current
Soft recovery parallel diodes with low forward voltage and leakage current
Kelvin emitter connection for simplified gate drive circuitry
Symmetrical design with lead frames for power connections to minimize stray inductance

Applications

AC and DC motor control systems
Switched Mode Power Supplies (SMPS)
Buck chopper circuits

Procurement Notes

Verify the specific revision level against the latest official datasheet before procurement. Confirm that the SP4 package outline matches the mechanical constraints of the target heatsink interface. Ensure proper electrostatic discharge handling procedures are followed during installation, as specified in application note APT0502.

Selection Notes

Select this component for applications requiring high-frequency operation up to 100 kHz. Evaluate the thermal resistance characteristics to ensure adequate heat sinking for the 833 W power dissipation rating. Consider the positive temperature coefficient of VCE(sat) when designing parallel configurations to ensure stable current sharing between multiple modules.

Part Context

This module belongs to the APTGF series of NPT IGBT power modules from Microchip Technology. It is designed for robust performance in industrial power conversion environments. The SP4 package provides an isolated mounting solution suitable for direct attachment to heatsinks while maintaining electrical isolation.