APTGF25DSK120T3G

Overview

The APTGF25DSK120T3G is a dual buck chopper NPT IGBT power module manufactured by Microsemi Corporation. It features two isolated legs with integrated fast recovery diodes in an SP3 package. The collector-emitter breakdown voltage is 1200 V, and the continuous collector current is 40 A at Tc = 25°C or 25 A at Tc = 80°C. Maximum power dissipation is 208 W at Tc = 25°C. The collector-emitter saturation voltage is 3.7 V max at VGE = 15V and IC = 25A (Tj = 25°C). Input capacitance is 1650 pF at VCE = 25V. The module includes an internal NTC thermistor with a resistance of 50 kΩ at 25°C.

Feature Summary

• Non-Punch Through (NPT) Fast IGBT technology providing low voltage drop and low tail current for high-frequency operation up to 50 kHz.
• Soft recovery parallel diodes with low forward voltage and low leakage current, rated for Reverse Bias Safe Operating Area (RBSOA) and Short Circuit Safe Operating Area (SCSOA).
• Kelvin emitter configuration designed for easy drive circuit connection and very low stray inductance.
• Integrated internal NTC thermistor for precise temperature monitoring.

Applications

• AC and DC motor control systems
• Switched Mode Power Supplies (SMPS)
• Dual Buck chopper circuits

Procurement Notes

Verify component authenticity through authorized Microsemi distributors. Confirm datasheet revision status prior to integration. Ensure electrostatic discharge handling procedures are strictly followed during assembly. Validate thermal interface material compatibility with the SP3 package mounting surface. Review application notes for specific mounting torque requirements.

Selection Notes

Select this module for applications requiring symmetrical dual-leg configurations with integrated freewheeling diodes. Evaluate thermal management capabilities based on the specified junction-to-case thermal resistance values. Consider the positive temperature coefficient of VCEsat for potential paralleling requirements. Verify gate drive voltage levels match the 15V standard operating condition.

Part Context

This component belongs to the Microsemi NPT IGBT Power Module family utilizing the SP3 isolated package format. It represents a discrete solution for medium-power switching applications where compact form factors and high reliability are required. The series integrates both switching elements and protection characteristics within a single screw-mountable unit.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Cross-referencing requires matching electrical ratings, package dimensions, and pinout configurations with equivalent NPT IGBT modules from other manufacturers.