APTGF50DH120T3G

APTGF50DH120T3G

$30.37
  • Description:IGBT MODULE 1200V 70A 312W SP3
  • Series:-

SKU:7673687970fb Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT MODULE 1200V 70A 312W SP3
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • IGBT Type:NPT
  • Configuration:Asymmetrical Bridge
  • Vce(on) (Max) @ Vge, Ic:3.7V @ 15V, 50A
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:-
  • Mounting Type:Chassis Mount
  • Package / Case:SP3
  • Supplier Device Package:SP3
  • Voltage - Collector Emitter Breakdown (Max):1200 V
  • Current - Collector (Ic) (Max):70 A
  • Power - Max:312 W
  • Current - Collector Cutoff (Max):250 µA
  • Input Capacitance (Cies) @ Vce:3.45 nF @ 25 V

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APTGF50DH120T3G

Overview

The APTGF50DH120T3G is a Non Punch Through (NPT) Fast IGBT power module manufactured by Microchip Technology. It features an asymmetrical bridge configuration within an isolated SP3 package. The device supports a maximum collector-emitter breakdown voltage of 1200 V and a continuous collector current of 70 A at Tc = 25°C, or 50 A at Tc = 80°C. Pulsed collector current reaches 150 A. The saturation voltage is typically 3.2 V at 50 A and 15 V gate drive. Maximum power dissipation is 312 W at Tc = 25°C. The junction temperature range spans from -40°C to 150°C.

Feature Summary

  • Non Punch Through (NPT) Fast IGBT technology providing low voltage drop and low tail current for high-frequency operation up to 50 kHz.
  • Integrated soft recovery parallel diodes with low forward voltage and leakage current.
  • Kelvin emitter connection designed to facilitate easy gate drive circuitry.
  • Internal NTC thermistor included for precise temperature monitoring.

Applications

  • AC and DC motor control systems
  • Switched Mode Power Supplies

Procurement Notes

Verify the specific revision status and manufacturing origin before procurement. Confirm that the SP3 package dimensions align with the target heatsink interface. Ensure electrostatic discharge handling procedures are strictly followed during installation, as specified in application note APT0502.

Selection Notes

Select this component for applications requiring robust short-circuit withstand capability rated at 300 A for 10 µs. Evaluate thermal management requirements based on the 0.4 °C/W junction-to-case thermal resistance. Verify that the operating frequency remains within the 50 kHz limit defined by the switching energy characteristics.

Part Context

This module belongs to the APTGF series of NPT IGBT power modules. It utilizes the SP3 plastic frame housing, which allows for direct mounting to a heatsink while maintaining electrical isolation. The design emphasizes positive temperature coefficient of VCEsat to support easy paralleling of multiple units.

Replacement Considerations

Direct replacements must match the 1200 V rating, SP3 footprint, and pinout configuration. Verify that alternative components maintain comparable switching speeds and thermal resistance values to ensure system performance consistency without redesigning the cooling infrastructure.

FAQ

What is the maximum short-circuit current rating?

The device can withstand a short-circuit current of 300 A for a duration of up to 10 µs at a junction temperature of 125°C.

How does the Kelvin emitter benefit the design?

The Kelvin emitter provides a dedicated low-inductance path for the gate drive return, minimizing stray inductance effects and ensuring stable switching performance.

Is the module suitable for high-frequency operation?

Yes, the NPT Fast IGBT technology supports switching frequencies up to 50 kHz due to its low tail current and optimized switching characteristics.

APTGF50DH120T3GAPTGF50DH120T3G
$30.37
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