APTGF90A60TG

APTGF90A60TG

  • Description:IGBT MODULE 600V 110A 416W SP4
  • Series:-

SKU:dcd05a64e108 Category: Brand:

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Product Detailed Parameters

  • Description:IGBT MODULE 600V 110A 416W SP4
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • IGBT Type:NPT
  • Configuration:Half Bridge
  • Vce(on) (Max) @ Vge, Ic:2.5V @ 15V, 90A
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:SP4
  • Supplier Device Package:SP4
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):110 A
  • Power - Max:416 W
  • Current - Collector Cutoff (Max):250 µA
  • Input Capacitance (Cies) @ Vce:4.3 nF @ 25 V

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APTGF90A60TG

Overview

The APTGF90A60TG is an Insulated Gate Bipolar Transistor module manufactured by Microchip Technology. It features a 600 V collector-emitter breakdown voltage and a continuous collector current of 110 A at 25 °C. The device utilizes a MODULE-12 flange mount package with isolated case connection. Key electrical characteristics include a maximum gate-emitter voltage of ±20 V and a typical saturation voltage of 1.9 V at 50 A. The module supports a junction temperature range from -40 °C to 175 °C, ensuring robust operation in high-power applications.

Feature Summary

  • Non-Punch Through (NPT) THUNDERBOLT IGBT technology for stable temperature behavior
  • Kelvin emitter configuration for simplified drive circuitry
  • Direct mounting capability to heatsink via isolated flange package
  • Low stray inductance design optimized for high-frequency operation

Applications

  • Phase leg inverters
  • Uninterruptible Power Supplies (UPS)
  • Motor control systems

Procurement Notes

Verify the specific suffix 'T' against official Microchip documentation to confirm tape-and-reel packaging versus tube variants. Ensure compatibility with existing thermal interface materials for the isolated flange mount. Cross-reference the exact part number with the manufacturer's latest datasheet revision to validate pinout and mechanical dimensions before integration.

Selection Notes

Select this component for designs requiring rugged NPT technology and direct heatsink mounting. The 600 V rating suits medium-voltage AC drives and industrial converters. Evaluate the 110 A current capacity against peak load requirements. Confirm that the system can accommodate the thermal resistance characteristics of the MODULE-12 package for effective heat dissipation.

Part Context

This module belongs to the THUNDERBOLT series of IGBTs, characterized by non-punch-through technology. It is designed for high reliability and low leakage current. The product line emphasizes ruggedness with avalanche energy ratings and symmetrical design features suitable for demanding power electronics environments.

Replacement Considerations

Consult Microchip's official cross-reference tools for verified substitutes. Ensure any replacement maintains the MODULE-12 footprint and 600 V/110 A specifications. Verify that alternative devices support Kelvin emitter connections if present in the original design.

APTGF90A60TGAPTGF90A60TG

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