APTGF90TDU60PG

Overview

The APTGF90TDU60PG is a triple dual common source Non Punch Through (NPT) IGBT power module manufactured by Microsemi Corporation. It features three phase legs with integrated anti-parallel diodes in an SP6-P package. The device supports a collector-emitter breakdown voltage of 600 V and a continuous collector current of 110 A at Tc=25°C. Maximum power dissipation is rated at 416 W, with a junction-to-case thermal resistance of 0.3 °C/W for the IGBTs. The module includes Kelvin emitters for low-inductance drive connections and is designed for high-frequency operation up to 100 kHz.

Feature Summary

• Triple phase leg configuration with NPT Fast IGBT technology providing low voltage drop and soft recovery parallel diodes
• Kelvin emitter terminals enable easy drive connection with very low stray inductance due to symmetrical design
• Isolated package allows direct mounting to heatsinks with low junction-to-case thermal resistance
• Solderable terminals for both power and signal connections facilitate easy PCB mounting

Applications

• AC Switches
• Switched Mode Power Supplies
• Uninterruptible Power Supplies

Procurement Notes

Verify component authenticity through authorized Microsemi distributors or certified suppliers. Confirm datasheet revision status and RoHS compliance documentation prior to integration. Ensure proper electrostatic discharge handling procedures are followed during storage and assembly to prevent damage to sensitive semiconductor structures.

Selection Notes

Select this module for applications requiring high-frequency switching capabilities up to 100 kHz and robust thermal performance. Evaluate gate resistance requirements against switching energy loss curves to optimize efficiency. Consider the positive temperature coefficient of VCEsat for easy paralleling if higher current capacity is needed beyond the single unit rating.

Part Context

This component belongs to the Thunderbolt IGBT E2 series from Microsemi, designed for high-power industrial applications. It utilizes Non Punch Through technology to ensure stable temperature behavior and ruggedness. The SP6-P package provides a low profile suitable for compact power electronics designs requiring high current density and reliable isolation.

Replacement Considerations

Direct substitutes include APTGF90TA60P and APTGF90A60T. Verify pinout compatibility and thermal characteristics when replacing. Ensure the alternative part meets the same voltage and current ratings for the specific application requirements.