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Product Detailed Parameters
- Description：IGBT MODULE 1200V 140A 517W SP6P
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Three Phase
- Vce(on) (Max) @ Vge, Ic：2.15V @ 15V, 100A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP6
- Supplier Device Package：SP6-P
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：140 A
- Power - Max：517 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：6.2 nF @ 25 V
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Overview
The APTGL120TA120TPG is a high-voltage, high-current Transient IGBT module manufactured by Microchip Technology. It features a maximum collector-emitter voltage of 1.2 kV and a saturated collector-emitter voltage ranging from 1.8 V to 2.15 V. The device supports a DC collector current with a continuous rating at 25°C, housed in an SP6 package. Designed for robust power applications, it operates within a temperature range of -40°C to +125°C and utilizes screw mount installation.
Feature Summary
- High-voltage transient IGBT design optimized for demanding power switching environments
- Low saturated collector-emitter voltage characteristics for efficient conduction
- Wide operating temperature range ensuring reliability under extreme thermal conditions
Applications
- Industrial motor drives
- Power conversion systems
- Inverter circuits
Procurement Notes
Verify the specific datasheet revision and electrical parameter tolerances against the official Microchip Technology documentation before integration. Confirm that the SP6 package dimensions and screw mounting requirements align with the target PCB or chassis design. Ensure gate drive circuitry supports the specified 20 V maximum gate-emitter voltage limits to prevent device damage during operation.
Selection Notes
Select this component when a 1.2 kV blocking capability and high current handling are required for transient power applications. The SP6 package offers a compact form factor suitable for space-constrained designs. Consider the thermal management requirements associated with the specified power dissipation and operating temperature range to ensure long-term system stability.
Part Context
This module belongs to Microchip Technology's portfolio of discrete semiconductor modules and IGBTs. It is part of the broader category of power modules designed for industrial and commercial applications. The product line emphasizes high reliability and performance in high-power switching scenarios, supporting various system architectures requiring robust voltage and current ratings.
Replacement Considerations
Consult official Microchip Technology substitution guides for verified alternative part numbers. Cross-reference pin configurations, electrical parameters, and mechanical dimensions to ensure compatibility with existing designs without modification.
