APTGLQ100A65T1G

APTGLQ100A65T1G

$52.10
  • Description:IGBT MODULE 650V 200A 350W SP1
  • Series:-

SKU:1273525a9abd Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT MODULE 650V 200A 350W SP1
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • IGBT Type:Trench Field Stop
  • Configuration:Half Bridge
  • Vce(on) (Max) @ Vge, Ic:2.3V @ 15V, 100A
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 175°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:SP1
  • Supplier Device Package:SP1
  • Voltage - Collector Emitter Breakdown (Max):650 V
  • Current - Collector (Ic) (Max):200 A
  • Power - Max:350 W
  • Current - Collector Cutoff (Max):100 µA
  • Input Capacitance (Cies) @ Vce:6 nF @ 25 V

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APTGLQ100A65T1G

Overview

The APTGLQ100A65T1G is a high-speed Trench + Field Stop IGBT4 phase leg power module manufactured by Microchip Technology. It features an isolated SP1 package with screw mounting and integrated gate resistors. The device supports a collector-emitter voltage of 650 V, with a continuous collector current of 135 A at 25°C case temperature and 100 A at 60°C. Key electrical parameters include a saturation voltage of 1.85 V (typical) at 100 A and 25°C, and a maximum power dissipation of 350 W. The module incorporates an internal NTC thermistor for thermal monitoring and operates within a junction temperature range of -40°C to 175°C.

Feature Summary

  • High speed Trench + Field Stop IGBT4 technology providing low voltage drop and switching losses
  • Very low stray inductance design for improved performance at high frequency operation
  • Internal thermistor for accurate temperature monitoring
  • Solderable terminals for both power and signal connections to facilitate easy PCB mounting

Applications

  • Welding converters
  • Switched Mode Power Supplies
  • Uninterruptible Power Supplies
  • Motor control

Procurement Notes

Verify the specific revision level of the datasheet against the ordered component to ensure compatibility with application requirements. Confirm that the SP1 package dimensions and mounting torque specifications align with the heatsink interface design. Ensure electrostatic discharge handling procedures are strictly followed during installation due to component sensitivity.

Selection Notes

Select this module for applications requiring high-frequency operation and low thermal resistance. Evaluate the thermal impedance curves against the expected duty cycle and pulse duration to ensure junction temperatures remain within the recommended operating range. Verify that the short-circuit withstand capability meets the protection circuitry limits of the system design.

Part Context

This component belongs to the Microchip Technology IGBT module family utilizing Trench + Field Stop IGBT4 technology. It is designed as a single-phase leg configuration, integrating both an IGBT switch and a freewheeling diode in one isolated package. The series emphasizes low profile construction and direct mounting capabilities for efficient thermal management in power electronics systems.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Cross-referencing requires matching the SP1 package outline, pinout configuration, and electrical ratings such as VCES and IC specifications.

APTGLQ100A65T1GAPTGLQ100A65T1G
$52.10
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