APTGLQ25H120T1G

$47.43

Description：IGBT MODULE 1200V 50A 165W SP1
Series：-

SKU:9902627f9e1e Category: IGBT Modules Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 1200V 50A 165W SP1
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Full Bridge
Vce(on) (Max) @ Vge, Ic：2.42V @ 15V, 25A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：SP1
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：50 A
Power - Max：165 W
Current - Collector Cutoff (Max)：50 µA
Input Capacitance (Cies) @ Vce：1.43 nF @ 25 V

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APTGLQ25H120T1G

Overview

The APTGLQ25H120T1G is a Trench Field Stop (TFS) IGBT module from Microchip Technology, configured as a full-bridge topology. It features a maximum collector-emitter voltage of 1200 V and a typical saturation voltage of 2.05 V. The continuous collector current is rated at 25 A at a case temperature of 80°C. Power dissipation is specified at 165 W. The device utilizes silicon technology and is housed in an SP1 package with screw mount installation. Operating junction temperature ranges from -40°C to 175°C.

Feature Summary

Integrates Trench Field Stop (TFS) technology for optimized switching performance.
Provides a complete full-bridge configuration within a single compact module.
Designed for high thermal efficiency with a wide operating junction temperature range.

Applications

Induction heating systems
High-frequency power supplies
Resonant converter circuits

Procurement Notes

Verify the specific ordering suffix and package variant against the official datasheet to ensure compatibility with the intended PCB or chassis mounting requirements. Confirm that the gate drive specifications align with the module's electrical characteristics before integration into the final design.

Selection Notes

Select this component when a compact full-bridge solution is required for high-frequency applications. The TFS technology offers advantages in switching speed and low conduction losses compared to standard planar devices. Ensure the thermal management system can handle the 165 W power dissipation rating under the expected load conditions.

Part Context

This part belongs to the APTGLQ series of IGBT modules, which are designed for high-performance power conversion. The series leverages Microchip's Trench Field Stop technology to deliver robust performance in demanding environments. The SP1 package provides a standardized form factor for easy integration into various power electronics designs.

Replacement Considerations

Direct substitutes may include other APTGLQ series variants with different current ratings or package options. Verify pinout compatibility and electrical parameters such as VCES and IC before considering alternative part numbers from the same manufacturer family.