APTGLQ300H65G

$217.23

Description：IGBT MODULE 650V 600A 1000W SP6
Series：-

SKU:60db1a97935b Category: IGBT Modules Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 650V 600A 1000W SP6
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Full Bridge
Vce(on) (Max) @ Vge, Ic：2.3V @ 15V, 300A
Input：Standard
NTC Thermistor：No
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Through Hole
Package / Case：SP6
Supplier Device Package：SP6
Voltage - Collector Emitter Breakdown (Max)：650 V
Current - Collector (Ic) (Max)：600 A
Power - Max：1000 W
Current - Collector Cutoff (Max)：300 µA
Input Capacitance (Cies) @ Vce：18.3 nF @ 25 V

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APTGLQ300H65G

Overview

The APTGLQ300H65G is a silicon IGBT module manufactured by Microchip Technology, housed in an SP6 screw-mount package. It features a full bridge configuration with a maximum collector-emitter voltage of 650 V and a continuous collector current of 385 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.85 V and a power dissipation rating of 1 kW. Operating within a temperature range of -40°C to +100°C, it includes a gate-emitter leakage current of 500 nA and a maximum gate-emitter voltage of 20 V.

Feature Summary

Full bridge topology for integrated power conversion stages
SP6 screw-mount packaging for robust mechanical installation
Silicon-based trench field-stop technology

Applications

Industrial motor drives
Uninterruptible power supplies
Inverter systems

Procurement Notes

Verify the specific revision level and RoHS compliance status through official Microchip documentation before integration. Confirm that the SP6 mounting interface matches the thermal management design requirements. Ensure the supply chain source provides valid traceability records for this semiconductor component.

Selection Notes

Select this module when a 650 V full bridge configuration is required with high current handling capabilities. The SP6 package suits applications needing screw-mount stability. Evaluate thermal resistance characteristics against the system's heat sink capacity to ensure operation remains within the specified junction temperature limits during peak loads.

Part Context

This component belongs to the APTGLQ series of high-speed IGBT4 power modules from Microchip Technology. These modules are engineered for efficiency in medium-power applications. The SP6 form factor is standard for this product line, facilitating compatibility with existing industrial power electronics designs requiring reliable switching performance.

Replacement Considerations

Direct substitutes include the APTGT300TL65G, which offers similar voltage ratings but different current and saturation characteristics. Verify pinout compatibility and thermal specifications before swapping components in existing assemblies.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.