APTGT100A170TG

Overview

The APTGT100A170TG is a silicon IGBT module manufactured by Microchip Technology, housed in an SP4 package. It features a half-bridge configuration with a maximum collector-emitter voltage of 1700 V and a continuous collector current rating of 150 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.5 V and supports a power dissipation of 560 W. Operating within a temperature range of -40°C to +100°C, it utilizes screw mount installation.

Feature Summary

• Utilizes trench field stop technology for high voltage capability
• Designed as a half-bridge configuration for efficient power switching
• Engineered for chassis mounting applications

Applications

• Industrial motor drives
• Uninterruptible power supplies
• High-frequency inverters

Procurement Notes

Verify the specific datasheet revision and RoHS compliance status prior to procurement, as availability information may vary across distributors. Confirm that the SP4 package dimensions match the mechanical constraints of the target application. Ensure thermal management solutions are adequate for the specified 560 W power dissipation rating under expected operating conditions.

Selection Notes

Select this component when a 1700 V rated half-bridge IGBT module is required for high-power applications. The 150 A continuous current rating suits moderate to high-load scenarios. Consider the SP4 package size and screw-mount requirement during PCB or chassis design. Compare performance metrics against alternative modules if higher current density or different packaging formats are necessary.

Part Context

This part belongs to Microchip's IGBT module portfolio, specifically utilizing trench field stop technology. It is designed for robust performance in demanding power electronics environments. The SP4 package provides a standardized form factor for integration into various industrial power conversion systems requiring reliable high-voltage switching capabilities.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing thermal interface materials and gate drive requirements before considering any alternative components from other manufacturers.