APTGT100BB60T3G

$51.23

Description：IGBT MODULE 600V 150A 340W SP3
Series：-

SKU:ea1e2acb16e1 Category: IGBT Modules Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 600V 150A 340W SP3
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Half Bridge
Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 100A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Through Hole
Package / Case：SP3
Supplier Device Package：SP3
Voltage - Collector Emitter Breakdown (Max)：600 V
Current - Collector (Ic) (Max)：150 A
Power - Max：340 W
Current - Collector Cutoff (Max)：250 µA
Input Capacitance (Cies) @ Vce：6.1 nF @ 25 V

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APTGT100BB60T3G

Overview

The APTGT100BB60T3G is a Trench Field Stop half-bridge IGBT module manufactured by Microchip Technology. It features a 600 V collector-emitter maximum voltage rating and supports a continuous collector current of 150 A at 25 °C. The device utilizes silicon technology and operates within a junction temperature range of -40 °C to +100 °C. It employs a screw mount installation style and is housed in an SP3 package configuration.

Feature Summary

Integrates Trench Field Stop half-bridge topology for efficient power switching
Designed for high-current applications with 150 A continuous collector current capability
Utilizes robust silicon-based semiconductor construction

Applications

Industrial motor drives
Inverter systems
Power supply units

Procurement Notes

Verify the specific datasheet revision and electrical characteristics against official Microchip documentation prior to integration. Confirm that thermal management solutions align with the module's power dissipation requirements and operating temperature limits. Ensure gate drive circuits comply with the specified maximum gate-emitter voltage ratings to prevent device damage during operation.

Selection Notes

Select this component for designs requiring a 600 V half-bridge configuration with substantial current handling capacity. Evaluate the SP3 package dimensions and screw mount requirements against the target PCB or chassis layout. Consider the thermal resistance and cooling strategy necessary to maintain safe operating temperatures under peak load conditions.

Part Context

This module belongs to Microchip's IGBT module portfolio, specifically utilizing Trench Field Stop technology. It serves as a discrete power switching solution for medium-power electronic applications, offering a balance between conduction losses and switching performance typical of silicon-based insulated-gate bipolar transistors.