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Product Detailed Parameters
- Description：IGBT MODULE 1700V 150A 560W SP6
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Full Bridge Inverter
- Vce(on) (Max) @ Vge, Ic：2.4V @ 15V, 100A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP6
- Supplier Device Package：SP6
- Voltage - Collector Emitter Breakdown (Max)：1700 V
- Current - Collector (Ic) (Max)：150 A
- Power - Max：560 W
- Current - Collector Cutoff (Max)：350 µA
- Input Capacitance (Cies) @ Vce：9 nF @ 25 V
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Overview
The APTGT100H170G is a Trench Field Stop IGBT module manufactured by Microchip Technology. It features a full bridge inverter configuration housed in an SP6 package. The device supports a maximum collector-emitter voltage of 1700 V and a continuous collector current of 150 A at 25°C. Key electrical parameters include a saturation voltage of 2.3 V, a power dissipation rating of 560 W, and a gate-emitter leakage current of 600 nA. The module operates within a temperature range of -40°C to +100°C and utilizes silicon technology.
Feature Summary
- Integrates Trench Field Stop IGBT technology for optimized switching performance
- Provides a complete full bridge inverter configuration within a single unit
- Designed for high-voltage applications with robust thermal management capabilities
Applications
- Industrial motor drives
- Uninterruptible power supplies
- Induction heating systems
Procurement Notes
Verify the specific ordering suffix and packaging details against the official datasheet before procurement. Confirm that the required quantity matches the manufacturer's standard tube packaging specifications. Ensure that the delivery timeline aligns with project schedules due to potential long lead times associated with this component type. Cross-reference the part number with authorized distributors to ensure authenticity.
Selection Notes
Select this module when a 1700 V rating and 150 A current capacity are required for inverter circuits. The SP6 package offers a compact solution for chassis mounting. Consider the thermal resistance and cooling requirements based on the 560 W power dissipation limit. Evaluate the switching characteristics against system efficiency targets compared to alternative technologies.
Part Context
This component belongs to the APTGT series of high-speed IGBT modules from Microchip Technology. These modules are engineered for demanding power conversion applications requiring high reliability. The SP6 package is commonly used in industrial and automotive power electronics. The series emphasizes low conduction losses and fast switching speeds.
Replacement Considerations
Direct replacements must match the 1700 V rating, 150 A current, and SP6 package form factor. Verify pin compatibility and thermal interface specifications. Consult the manufacturer's cross-reference guide for approved equivalent parts.
