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Product Detailed Parameters
- Description：IGBT MODULE 1700V 250A 890W SP6
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Asymmetrical Bridge
- Vce(on) (Max) @ Vge, Ic：2.4V @ 15V, 150A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-
- Mounting Type：Chassis Mount
- Package / Case：SP6
- Supplier Device Package：SP6
- Voltage - Collector Emitter Breakdown (Max)：1700 V
- Current - Collector (Ic) (Max)：250 A
- Power - Max：890 W
- Current - Collector Cutoff (Max)：350 µA
- Input Capacitance (Cies) @ Vce：13.5 nF @ 25 V
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Overview
The APTGT150DH170G is a Trench Field Stop asymmetrical bridge IGBT module manufactured by Microchip Technology. It features a SP6 package and screw mount installation style. The device supports a maximum collector-emitter voltage of 1700 V and a continuous collector current of 250 A at 25°C. Power dissipation is rated at 890 W, with a gate-emitter maximum voltage of 20 V. Operating temperature ranges from -40°C to +100°C.
Feature Summary
- Utilizes Trench Field Stop technology for optimized switching performance
- Asymmetrical bridge configuration designed for high-power applications
- SP6 chassis mount package facilitates robust thermal management
Applications
- Industrial motor drives
- Uninterruptible power supplies
- Induction heating systems
Procurement Notes
Verify the specific datasheet revision and product change notifications prior to procurement. Confirm that the SP6 package dimensions and mounting hole patterns match the target design requirements. Ensure thermal interface materials are compatible with the module's baseplate specifications for optimal heat transfer efficiency.
Selection Notes
Select this component for applications requiring high voltage blocking capabilities and significant current handling in a compact form factor. Consider the thermal resistance characteristics when designing heatsink solutions. Evaluate the switching speed trade-offs inherent to Trench Field Stop technology against system efficiency targets.
Part Context
This module belongs to the APTGT series of IGBT modules from Microchip Technology. It represents a discrete power semiconductor solution intended for medium to high-power conversion tasks. The SP6 packaging standard ensures compatibility with established industrial mounting practices and cooling infrastructure.
Replacement Considerations
Direct substitutes include the APTGT150DH170TG variant within the same manufacturer lineup. Cross-manufacturer replacements require careful verification of pinout compatibility, thermal characteristics, and electrical ratings to ensure functional equivalence.
