ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IGBT MODULE 600V 290A 750W SP3
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Single
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 200A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP3
- Supplier Device Package：SP3
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：290 A
- Power - Max：750 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：12.3 nF @ 25 V
Download product information
Overview
The APTGT200DA60T3AG is a single IGBT module manufactured by Microchip Technology, utilizing silicon technology. It features a maximum collector-emitter voltage of 600 V and a continuous collector current of 290 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.5 V and a gate-emitter leakage current of 400 nA. Maximum power dissipation is rated at 750 W, with a maximum gate-emitter voltage of 20 V. The component operates within a temperature range of -40°C to +100°C and is housed in an SP3-32 package designed for screw mount installation.
Feature Summary
- Single configuration IGBT module built on silicon technology
- SP3-32 package format supporting screw mount installation
- Rated for 600 V collector-emitter voltage and 290 A continuous current
Applications
- Industrial motor drives
- Uninterruptible power supplies
- Inverter systems
Procurement Notes
Verify the complete part number including suffixes against official Microchip Technology documentation before procurement. Confirm that the specific revision matches project requirements. Check for any recent product change notices or datasheet updates that may affect electrical characteristics or mechanical dimensions. Ensure compatibility with existing thermal management solutions.
Selection Notes
Select this module for applications requiring a single high-current switch with 600 V blocking capability. Evaluate thermal resistance and heat sink compatibility given the 750 W power dissipation rating. Consider the operating temperature range limits when designing enclosure ventilation. Verify gate drive voltage levels do not exceed the 20 V maximum specification.
Part Context
This component belongs to the Microchip Technology APTGT series of IGBT modules. These modules are designed for power conversion applications requiring robust switching performance. The series utilizes trench field-stop technology to optimize conduction and switching losses. The SP3 package family provides standardized mounting interfaces for various power ratings within the lineup.
Replacement Considerations
Direct replacements must match the 600 V rating, 290 A current capacity, and SP3-32 package footprint. Verify pinout compatibility and thermal interface specifications. Consult Microchip Technology for qualified alternative part numbers within the same product family.
