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The APTGT200SK120G is a silicon IGBT module manufactured by Microchip Technology, housed in an SP6 screw-mount package. It features a single configuration with a maximum collector-emitter voltage of 1.2 kV and a continuous collector current of 280 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.7 V and a gate-emitter leakage current of 500 nA. Maximum power dissipation is rated at 890 W, while the maximum gate-emitter voltage is 20 V. The operational temperature range spans from -40°C to +100°C, with a unit weight of 110 g.
Verify the specific datasheet revision and RoHS compliance status directly with Microchip Technology or authorized distributors before procurement. Confirm that the SP6 package dimensions match the target thermal interface design. Ensure the ordering suffix corresponds to the required packaging format. Cross-reference the part number against the latest manufacturing change notices to confirm component availability and production status.
Select this component when a single-switch topology is required with 1.2 kV blocking capability. The 280 A continuous current rating suits applications demanding significant power throughput. Verify that the system cooling solution can manage the 890 W power dissipation limit. Ensure the drive circuit provides the specified 20 V gate-emitter voltage tolerance. Compare thermal resistance values against alternative packages if space constraints exist.
This module belongs to the APTGT series of trench field-stop IGBTs produced by Microchip Technology. The SP6 package provides a standardized footprint for high-power industrial applications. The series integrates advanced silicon technology to balance conduction losses and switching speeds. It serves as a core switching element in medium to high-power electronic conversion circuits.
Direct replacements within the same package and electrical specifications are limited. Evaluate other APTGT series variants with matching voltage and current ratings. Verify pin compatibility and thermal characteristics before substituting with modules from different manufacturers.