ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IGBT MODULE 1700V 340A 1250W SP6
- Series：-
- Mfr：Microsemi Corporation
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Single
- Vce(on) (Max) @ Vge, Ic：2.4V @ 15V, 225A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP6
- Supplier Device Package：SP6
- Voltage - Collector Emitter Breakdown (Max)：1700 V
- Current - Collector (Ic) (Max)：340 A
- Power - Max：1250 W
- Current - Collector Cutoff (Max)：500 µA
- Input Capacitance (Cies) @ Vce：20 nF @ 25 V
Download product information
Overview
The APTGT225DA170G is a dual IGBT module manufactured by Microchip Technology, formerly Microsemi. It utilizes NPT (Non-Punch Through) technology and is housed in an SP6 package designed for screw mounting. The device features a maximum collector-emitter voltage of 1.7 kV and a continuous collector current of 340 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 2 V, a gate-emitter leakage current of 600 nA, and a power dissipation rating of 1.25 kW. The module operates within a temperature range of -40°C to +100°C and has a unit weight of 110 g.
Feature Summary
- Dual configuration utilizing NPT IGBT technology for high-voltage applications
- SP6 package design optimized for screw-mount installation
- High thermal stability with defined operating temperature limits
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify the manufacturer designation carefully, as the component is listed under both Microsemi Corporation and Microchip Technology due to corporate acquisition history. Confirm the specific suffix 'G' indicates lead-free compliance if required by your assembly process. Cross-reference the datasheet revision date to ensure compatibility with your system's thermal and electrical requirements before finalizing procurement orders.
Selection Notes
Select this module when a dual IGBT configuration with 1.7 kV blocking capability is required. Ensure the cooling solution supports the 1.25 kW power dissipation rating. Verify that the drive circuitry can handle the specified gate-emitter voltage limits. Compare the SP6 package dimensions against your PCB or chassis layout constraints to confirm mechanical fitment.
Part Context
This component belongs to the APTGT series of high-power IGBT modules from Microchip Technology. The series is characterized by robust NPT technology suitable for demanding industrial environments. The SP6 package is a standard form factor used across various voltage ratings within the product line, facilitating modular design approaches in power electronics.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided documentation. Evaluate other APTGT series modules with similar voltage and current ratings, ensuring package compatibility and electrical parameter alignment.
