APTGT300H60G

$217.23

Description：IGBT MODULE 600V 430A 1150W SP6
Series：-

SKU:b11a5c21b965 Category: IGBT Modules Brand: Microchip Technology

Consult the customer manager about the wholesale price.

consultation hotline：86-132-6715-2157

email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.

Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Product introduction

Product Detailed Parameters

Description：IGBT MODULE 600V 430A 1150W SP6
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Full Bridge Inverter
Vce(on) (Max) @ Vge, Ic：1.8V @ 15V, 300A
Input：Standard
NTC Thermistor：No
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP6
Supplier Device Package：SP6
Voltage - Collector Emitter Breakdown (Max)：600 V
Current - Collector (Ic) (Max)：430 A
Power - Max：1150 W
Current - Collector Cutoff (Max)：350 µA
Input Capacitance (Cies) @ Vce：24 nF @ 25 V

Download product information

APTGT300H60G

Overview

The APTGT300H60G is a full-bridge IGBT power module utilizing Trench + Field Stop IGBT3 technology. It features a 600 V collector-emitter breakdown voltage and a continuous collector current of 430 A at 25°C, decreasing to 300 A at 80°C case temperature. The saturation voltage is typically 1.4 V at 25°C and 1.5 V at 150°C for a 300 A load. Maximum power dissipation reaches 1150 W at 25°C. The module operates within a junction temperature range of -40°C to 175°C and includes integrated soft recovery parallel diodes with a forward voltage of 1.5 V.

Feature Summary

Trench + Field Stop IGBT3 technology providing low voltage drop and low tail current
Kelvin emitter configuration designed for easy drive circuitry
Symmetrical design with M5 power connectors ensuring very low stray inductance
Integrated soft recovery parallel diodes characterized by low forward voltage

Applications

Welding converters
Switched Mode Power Supplies
Uninterruptible Power Supplies
Motor control systems

Procurement Notes

Verify the specific revision level against the latest Microchip Technology datasheet before integration. Confirm that the SP6 package mounting torque requirements are met during assembly. Ensure electrostatic discharge handling procedures are strictly followed as the device is sensitive to ESD. Validate thermal interface material compatibility for the specified operating temperatures.

Selection Notes

Select this component for applications requiring high current density in a full-bridge topology. The positive temperature coefficient of VCE(sat) facilitates stable paralleling if higher currents are needed. Consider the 175°C maximum junction temperature for high-temperature environments. Verify gate resistance values to ensure switching losses remain within acceptable limits for the specific frequency requirements.

Part Context

This module belongs to the APTGT series of full-bridge power modules manufactured by Microchip Technology. It utilizes the SP6 isolated package format, which allows direct mounting to heatsinks. The series is engineered for industrial power conversion applications where ruggedness and high integration levels are required.