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Product Detailed Parameters
- Description：IGBT MODULE 1200V 420A 1380W SP6
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Single
- Vce(on) (Max) @ Vge, Ic：2.1V @ 15V, 300A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP6
- Supplier Device Package：SP6
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：420 A
- Power - Max：1380 W
- Current - Collector Cutoff (Max)：500 µA
- Input Capacitance (Cies) @ Vce：21 nF @ 25 V
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Overview
The Microchip Technology APTGT300SK120G is a single IGBT power module utilizing silicon technology. It features a maximum collector-emitter voltage of 1.2 kV and a continuous collector current of 420 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.7 V and a gate-emitter leakage current of 600 nA. Maximum power dissipation is rated at 1.38 kW, with an operating temperature range from -40°C to +100°C. The unit employs screw mount installation within an SP6 package and supports a maximum gate-emitter voltage of 20 V.
Feature Summary
- Single configuration IGBT module designed for high-power switching applications
- SP6 package format enabling robust screw mount installation
- Silicon-based construction optimized for industrial power conversion
Applications
- Industrial motor drives
- Uninterruptible power supplies
- High-frequency inverters
Procurement Notes
Verify the specific ordering suffix against official Microchip documentation to confirm exact electrical characteristics and packaging details. Confirm RoHS compliance status through the manufacturer's latest datasheet before procurement. Ensure thermal management solutions align with the specified 1.38 kW power dissipation rating. Validate that the SP6 package dimensions match the target mechanical design constraints.
Selection Notes
Select this component when a single IGBT configuration with 1.2 kV blocking capability is required. The 420 A current rating suits medium-to-high power density designs. Consider the SP6 package compatibility for existing board layouts. Evaluate thermal resistance requirements against the 1.38 kW dissipation limit. Compare against other APTGT series variants if different current or voltage ratings are needed.
Part Context
This part belongs to the Microchip APTGT series of high-voltage IGBT modules. The series utilizes trench field-stop technology for improved switching performance. The SP6 package is a standard form factor used across multiple current ratings in this product line. It serves as a core switching element in various power electronic topologies requiring reliable high-current handling.
Replacement Considerations
Direct substitutes include the APTGT300SK120D3G, which offers similar electrical parameters but utilizes a D3-11 package. Verify pinout compatibility and mounting hole patterns when considering alternative packages. Check for any differences in thermal characteristics or switching speeds between package types.
