APTGT30DSK60T3G

$26.41

Description：IGBT MODULE 600V 50A 90W SP3
Series：-

SKU:bc0921523109 Category: IGBT Modules Brand: Microsemi Corporation

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 600V 50A 90W SP3
Series：-
Mfr：Microsemi Corporation
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Dual Buck Chopper
Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 30A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP3
Supplier Device Package：SP3
Voltage - Collector Emitter Breakdown (Max)：600 V
Current - Collector (Ic) (Max)：50 A
Power - Max：90 W
Current - Collector Cutoff (Max)：250 µA
Input Capacitance (Cies) @ Vce：1.6 nF @ 25 V

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APTGT30DSK60T3G

Overview

The APTGT30DSK60T3G is a dual buck chopper IGBT power module manufactured by Microsemi Corporation. It utilizes Trench Field Stop technology to deliver high-performance switching capabilities. The module features a collector current of 30A and a voltage rating of 600V. Key electrical parameters include an input capacitance of 1.6 nF at 25 V and a collector cutoff current of 250 µA. Packaged in bulk, this component is designed for robust industrial applications requiring efficient power conversion.

Feature Summary

Dual buck chopper configuration utilizing Trench Field Stop IGBT technology
Optimized for high-efficiency power conversion with low switching losses
Designed for reliable operation in demanding industrial environments

Applications

Industrial motor drives
Power supply systems
Inverter circuits

Procurement Notes

Verify the manufacturer part number against official Microsemi documentation to ensure authenticity. Confirm that the specific package type matches project requirements. Check for any obsolescence notices or lifecycle status updates from the manufacturer before finalizing procurement plans. Ensure storage conditions comply with moisture sensitivity level guidelines.

Selection Notes

Select this module when a dual buck chopper topology is required within a 600V system. Consider the 30A current rating and thermal management needs for the specific application. Evaluate the Trench Field Stop technology benefits for efficiency compared to standard IGBTs. Ensure the SP1 package dimensions fit the mechanical constraints of the design.

Part Context

This component belongs to the Microsemi IGBT module family, specifically designed for power electronics applications. It represents the integration of advanced semiconductor technology into a compact power module format. The product line focuses on providing reliable solutions for industrial and commercial power conversion systems.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material. Consult official Microsemi documentation for potential cross-references or updated series replacements.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.