APTGT50A1202G

$24.83

Description：IGBT MODULE 1200V 75A 277W SP2
Series：-

SKU:b4c631226bdb Category: IGBT Modules Brand: Microsemi Corporation

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 1200V 75A 277W SP2
Series：-
Mfr：Microsemi Corporation
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Half Bridge
Vce(on) (Max) @ Vge, Ic：2.1V @ 15V, 50A
Input：Standard
NTC Thermistor：No
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP2
Supplier Device Package：SP2
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：75 A
Power - Max：277 W
Current - Collector Cutoff (Max)：50 µA
Input Capacitance (Cies) @ Vce：3.6 nF @ 25 V

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APTGT50A1202G

Overview

The APTGT50A1202G is a half-bridge IGBT module utilizing Trench Field Stop technology. It features a 1200 V collector-emitter breakdown voltage and a continuous collector current of 75 A at case temperature. The module has a maximum power dissipation of 277 W and operates within a junction temperature range of -40°C to +150°C. It uses the SP2 package for chassis mounting.

Feature Summary

Half-bridge configuration with Trench Field Stop IGBT3 technology
Low voltage drop and reduced tail current characteristics
Chassis mount design in SP2 package

Applications

Industrial motor drives
Inverter systems
Power supplies

Procurement Notes

Verify component status as obsolete or end-of-life through official Microchip channels. Confirm availability of last-time buy options if production continuity is required. Ensure compatibility with existing thermal management solutions designed for the SP2 package footprint.

Selection Notes

Select this module for applications requiring high voltage isolation and efficient switching performance. Consider the 75 A current rating and 277 W power dissipation limits when designing heat sinks. Verify gate drive requirements align with the specific electrical characteristics of the Trench Field Stop technology.

Part Context

This component belongs to Microsemi's high-power discrete and module portfolio, specifically designed for robust industrial applications. The SP2 package provides a standardized form factor for chassis mounting, facilitating integration into larger power conversion systems.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult official Microchip resources for potential obsolescence management strategies or alternative product lines.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.