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The APTGT50H60RT3G is a trench field-stop IGBT module manufactured by Microchip Technology. It features a full bridge inverter configuration housed in an SP3 base-mounted package. The device supports a maximum collector-emitter voltage of 600 V and a continuous collector current of 80 A at 25°C. Maximum power dissipation is rated at 176 W, with a junction temperature range from -40°C to 175°C. The saturation voltage is specified as 1.9 V maximum at 15 V gate drive and 50 A collector current. Input capacitance is 3.15 nF at 25 V, and leakage current is 250 µA.
Verify the specific suffix RT3G against official Microchip documentation to confirm packaging and tape-and-reel specifications. Ensure compatibility with existing PCB footprints for the SP3 package. Confirm RoHS compliance status through the manufacturer's latest datasheet or product change notification records before finalizing procurement orders.
Select this component when a 600 V, 80 A full bridge configuration is required within an SP3 footprint. Compare the 1.9 V saturation voltage at 50 A against system loss requirements. Verify that the 176 W power dissipation rating aligns with the available thermal management infrastructure and ambient operating conditions.
This module belongs to the APTGT50 series of high-power IGBT modules. It shares core electrical characteristics with variants like APTGT50H60T3G but differs in packaging format. The SP3 package distinguishes it from other form factors in the lineup, offering specific mechanical mounting solutions for industrial power applications.
APTGT50H60T3G offers identical electrical ratings but utilizes a different SP3-32 package variant. Verify mechanical pinout and mounting hole dimensions before substitution. APTGT50DH60T1G provides similar voltage and current specs but uses an SP1 package.