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Product Detailed Parameters
- Description：IGBT MODULE 600V 80A 176W SP3
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Three Level Inverter
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 50A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP3
- Supplier Device Package：SP3
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：80 A
- Power - Max：176 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：3.15 nF @ 25 V
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Overview
The Microchip Technology APTGT50TL60T3G is a single IGBT power module utilizing trench field-stop technology. It features a maximum collector-emitter voltage (Vceo) of 600 V and a continuous collector current of 50 A at 25°C. The device has a typical collector-emitter saturation voltage of 1.9 V at 50 A and 15 V gate drive. Maximum power dissipation is rated at 176 W. It operates within a junction temperature range of -40°C to +175°C. The component is housed in an SP3 screw-mount package.
Feature Summary
- Incorporates trench field-stop IGBT technology for optimized switching performance.
- Designed for high-temperature operation with a maximum junction rating of 175°C.
- Utilizes the SP3 screw-mount package configuration for robust mechanical mounting.
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- High-frequency welding inverters
Procurement Notes
Verify the specific suffix T3G against official Microchip documentation to confirm package type and tape-and-reel specifications. Ensure compatibility with existing thermal interface materials and mounting hardware for the SP3 footprint. Cross-reference the latest datasheet revision to validate electrical parameters before finalizing procurement orders.
Selection Notes
Select this module for applications requiring 600 V blocking capability and moderate current handling up to 50 A. Consider the SP3 package dimensions for PCB or chassis layout constraints. Evaluate thermal management requirements based on the 176 W power dissipation rating and ensure the cooling solution supports the specified junction temperature limits under expected load conditions.
Part Context
This component belongs to the APTGT series of IGBT modules from Microchip Technology, formerly known as Advanced Power Technology. The series utilizes trench field-stop technology to balance conduction losses and switching speeds. The APTGT50TL60T3G specifically targets single-switch applications within the 600 V voltage class.
Replacement Considerations
Direct substitutes include other Microchip APTGT series modules with identical 600 V ratings and SP3 packaging, such as the APTGT50H60T3G for full-bridge configurations or APTGT50DH60T1G for asymmetric bridge setups. Verify pinout compatibility and thermal characteristics when considering alternative part numbers.
