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Product Detailed Parameters
- Description：IGBT MODULE 600V 80A 176W SP3
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Three Phase Inverter
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 50A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP3
- Supplier Device Package：SP3
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：80 A
- Power - Max：176 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：3.15 nF @ 25 V
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Overview
The APTGT50X60T3G is a silicon IGBT module manufactured by Microchip Technology, housed in an SP-3 screw-mount package. It features a 3-phase inverter configuration with a maximum collector-emitter voltage of 600 V and a continuous collector current of 80 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.5 V and a gate-emitter leakage current of 600 nA. Power dissipation is rated at 176 W, with a maximum gate-emitter voltage of 20 V. Operating temperatures range from -40°C to +175°C junction temperature.
Feature Summary
- Utilizes trench field-stop IGBT technology for efficient power switching.
- Designed for three-phase inverter applications requiring robust thermal performance.
- Features a screw-mount SP-3 package for secure mechanical installation.
Applications
- Three-phase motor drives
- Industrial inverters
- Uninterruptible power supplies
Procurement Notes
Verify the specific suffix T3G against official Microchip documentation to confirm packaging and tape-and-reel specifications. Ensure the SP-3 package dimensions match the target heatsink interface. Confirm RoHS compliance status through the manufacturer's latest datasheet before finalizing procurement orders.
Selection Notes
Select this component when a 600V rating and 80A continuous current are required for three-phase topologies. The SP-3 package offers a balance of current capacity and thermal management for medium-power applications. Verify that the system's cooling solution can handle the 176W power dissipation rating under worst-case operating conditions.
Part Context
This part belongs to the APTGT series of high-speed IGBT modules from Microchip Technology. It shares the SP-3 form factor with other variants like the APTGT50H60RT3G but differs in internal configuration as a 3-phase inverter rather than a full bridge or single switch.
Replacement Considerations
Direct substitutes include other Microchip APTGT50 series modules in the SP-3 package, such as the APTGT50H60RT3G, provided the electrical parameters and pinout compatibility are verified against the specific application requirements.
