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Product Detailed Parameters
- Description：IGBT MODULE 600V 100A 250W SP3
- Series：-
- Mfr：Microsemi Corporation
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Dual Buck Chopper
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 75A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP3
- Supplier Device Package：SP3
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：100 A
- Power - Max：250 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：4.62 nF @ 25 V
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Overview
The APTGT75DSK60T3G is a dual buck chopper IGBT power module manufactured by Microsemi Corporation. It utilizes Trench + Field Stop technology and features a SP3 package configuration. The device supports a maximum collector-emitter voltage of 600 V and delivers a continuous collector current of 100 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 1.5 V, a gate-emitter leakage current of 600 nA, and a power dissipation rating of 250 W. The module operates within a junction temperature range of -40°C to 175°C.
Feature Summary
- Dual Buck Chopper Configuration
- Trench + Field Stop Technology
- SP3 Package Design
Applications
- Industrial motor drives
- Power conversion systems
- Inverter circuits
Procurement Notes
Verify the specific datasheet version and manufacturer documentation for the APTGT75DSK60T3G before procurement. Confirm that the SP3 package dimensions and screw mount requirements align with your thermal management design. Ensure compliance with RoHS standards as indicated in official product specifications. Cross-reference part numbers with authorized distributors to confirm availability and authenticity.
Selection Notes
Select this module for applications requiring high efficiency and robust performance in medium-power scenarios. The Trench + Field Stop technology offers improved switching characteristics compared to standard IGBTs. Consider the 600V rating and 100A current capacity when designing circuits. Evaluate thermal resistance and heat sink compatibility due to the 250W power dissipation limit in the SP3 package.
Part Context
This component belongs to the Microsemi (now Microchip) APTGT series of IGBT modules. These modules are designed for industrial and automotive applications requiring reliable power switching. The SP3 package provides a compact solution for mounting on printed circuit boards or direct to heatsinks. The series emphasizes low conduction losses and high thermal stability.
Replacement Considerations
The APTGT75H60T3G is a full bridge variant within the same family, sharing similar voltage and current ratings but differing in internal configuration. Verify pinout compatibility and thermal interface requirements when substituting. Consult official Microchip documentation for detailed cross-reference information.
