APTGT75TDU60PG

Overview

The APTGT75TDU60PG is a triple dual common source IGBT power module manufactured by Microchip Technology. It utilizes Trench + Field Stop technology and features a SP6-P isolated package designed for screw mounting. The device supports a collector-emitter breakdown voltage of 600 V and a continuous collector current of 100 A at 25°C case temperature, or 75 A at 80°C. Maximum power dissipation is rated at 250 W at 25°C. The module integrates three legs with soft recovery parallel diodes, offering low saturation voltage and high switching frequency capability up to 20 kHz.

Feature Summary

• Trench + Field Stop IGBT technology providing low voltage drop and low tail current
• Triple dual common source configuration allowing easy paralleling for increased current capability
• Kelvin emitter connection for simplified gate drive circuitry
• Soft recovery parallel diodes with low forward voltage and leakage current

Applications

• AC Switches
• Switched Mode Power Supplies
• Uninterruptible Power Supplies

Procurement Notes

Verify the specific revision level against the manufacturer's datasheet before procurement, as component specifications may be subject to change without notice. Confirm that the SP6-P package dimensions and mounting torque requirements align with the intended heatsink interface. Ensure electrostatic discharge handling procedures are followed during storage and installation to prevent damage to the sensitive semiconductor junctions.

Selection Notes

Select this module for applications requiring a compact, isolated power stage with integrated freewheeling diodes. The SP6-P package offers a low profile suitable for space-constrained designs. Evaluate thermal management requirements based on the specified junction-to-case thermal resistance values. Consider the positive temperature coefficient of VCE(sat) when designing circuits that require stable temperature behavior or direct paralleling of multiple units.

Part Context

This component belongs to the APTGT series of power modules from Microchip Technology (formerly Microsemi). The series employs advanced trench field stop IGBT technology to achieve high efficiency and ruggedness. The SP6-P packaging standardizes the footprint for various current ratings within the family, facilitating design reuse across different power levels while maintaining consistent mechanical mounting interfaces.

Replacement Considerations

Direct pin-compatible replacements within the same package family include the APTGT50TDU60PG and APTGT100TDU60PG. These variants share the SP6-P outline but differ in current ratings and thermal characteristics. Verify that the alternative part meets the specific voltage and current requirements of the application before substitution.