APTGTQ200A65T3G

$77.01

Description：IGBT MODULE 650V 200A 483W SP3F
Series：-

SKU:757093f7aafe Category: IGBT Modules Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 650V 200A 483W SP3F
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：-
Configuration：Half Bridge
Vce(on) (Max) @ Vge, Ic：2.2V @ 15V, 200A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：SP3F
Voltage - Collector Emitter Breakdown (Max)：650 V
Current - Collector (Ic) (Max)：200 A
Power - Max：483 W
Current - Collector Cutoff (Max)：200 µA
Input Capacitance (Cies) @ Vce：12 nF @ 25 V

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APTGTQ200A65T3G

Overview

The APTGTQ200A65T3G is a single IGBT module manufactured by Microchip Technology, utilizing silicon technology. It features a maximum collector-emitter voltage of 650 V and a continuous collector current of 200 A at 25°C. The device has a collector-emitter saturation voltage of 1.65 V and a power dissipation rating of 483 W. It operates within a temperature range of -40°C to +125°C and uses the SP3F package with screw mount installation.

Feature Summary

Single configuration for dedicated switching applications
SP3F package design for standardized mounting
Silicon-based construction for thermal stability

Applications

Industrial motor drives
Uninterruptible power supplies
Inverter circuits

Procurement Notes

Verify the exact part number against official Microchip documentation, as the specific suffix 'APTGTQ200A65T3G' may differ from standard listings. Confirm availability through authorized distributors and check for any recent product change notifications that might affect specifications or packaging.

Selection Notes

Select this module for applications requiring 650 V blocking capability and 200 A current handling. Ensure the cooling solution supports the 483 W power dissipation. Verify compatibility with the SP3F footprint and screw-mount requirements during mechanical design integration.

Part Context

This component belongs to the Microchip IGBT module family, specifically designed for power conversion systems. It shares the SP3F form factor with other modules in the series, facilitating interchangeability in designs where voltage ratings align with system requirements.

Replacement Considerations

Direct substitutes include the APTGTQ200SK65T3G, which shares identical electrical parameters and package type. Verify pinout compatibility and thermal characteristics before substitution.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

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Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.