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Product Detailed Parameters
- Description：PM-IGBT-TFS-SP3F
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：-
- Configuration：Dual, Common Emitter
- Vce(on) (Max) @ Vge, Ic：1.8V @ 15V, 100A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：185 A
- Power - Max：576 W
- Current - Collector Cutoff (Max)：15 µA
- Input Capacitance (Cies) @ Vce：20000 pF @ 25 V
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Overview
The Microchip Technology APTGX120DU120T3AG is a Trench 7 IGBT power module in the SP3F package. It features a dual common emitter configuration with a collector-emitter voltage of 1200 V and saturation voltage of 1.55 V. The device supports a continuous collector current of 185 A at 25°C, with a maximum power dissipation of 576 W. Operating temperatures range from -40°C to +125°C, utilizing press-fit mounting.
Feature Summary
- Incorporates Trench 7 silicon technology for enhanced switching performance
- Integrates an NTC thermistor for precise thermal monitoring
- Utilizes SP3F chassis mount packaging for robust mechanical stability
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- High-frequency induction heating systems
Procurement Notes
Verify component authenticity through authorized Microchip distributors. Confirm RoHS3 compliance status prior to integration. Ensure handling procedures adhere to ESD protection standards. Validate datasheet revisions against specific production batches to guarantee parameter consistency during procurement.
Selection Notes
Select this module for applications requiring high current density and efficient thermal management. The dual common emitter design simplifies circuit topology compared to half-bridge configurations. Consider the 185 A rating relative to system load requirements and verify compatibility with press-fit assembly processes for optimal contact reliability.
Part Context
This component belongs to the APTGX series of high-power IGBT modules. It represents a specialized solution within Microchip's portfolio for demanding industrial environments. The SP3F form factor distinguishes it from standard discrete packages, offering superior heat dissipation capabilities for sustained high-load operations.
Replacement Considerations
Consult official Microchip documentation for verified substitute part numbers. Cross-reference pinout compatibility and thermal resistance values when evaluating alternatives. Ensure any replacement maintains equivalent voltage and current ratings to preserve system integrity.
