APTGX300DU120T6G

$131.33

Description：PM-IGBT-TFS-SP6C
Series：-

SKU:0270d19162dd Category: IGBT Modules Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：PM-IGBT-TFS-SP6C
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：-
Configuration：Dual, Common Emitter
Vce(on) (Max) @ Vge, Ic：1.8V @ 15V, 300A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：415 A
Power - Max：1.02 kW
Current - Collector Cutoff (Max)：24 µA
Input Capacitance (Cies) @ Vce：60000 pF @ 25 V

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APTGX300DU120T6G

Overview

The APTGX300DU120T6G is a dual common emitter IGBT power module manufactured by Microchip Technology. It features a TFS-SP6C package designed for high-power applications. The device operates with a maximum collector-emitter voltage of 1.2 kV and delivers a continuous collector current of 415 A at 25°C. The saturation voltage is specified at 1.8 V, while the gate-emitter leakage current remains at 200 nA. Power dissipation capability reaches 1.02 kW. This component utilizes silicon technology and is classified under the PM-IGBT-TFS-SP6C product line.

Feature Summary

Dual common emitter configuration for bridge circuit integration
High current handling capability suitable for demanding power conversion tasks
Optimized switching characteristics associated with IGBT4 technology

Applications

Industrial motor drives
Uninterruptible power supplies
Induction heating systems

Procurement Notes

Verify part authenticity through authorized Microchip Technology distributors or direct manufacturer channels. Confirm RoHS compliance status via official documentation before integration. Ensure storage conditions meet semiconductor handling standards to prevent moisture damage. Validate package integrity upon receipt to guarantee proper thermal interface performance during installation.

Selection Notes

Select this module when designing circuits requiring 1.2 kV blocking voltage and high continuous current capacity. Consider the TFS-SP6C package dimensions for mechanical layout constraints. Evaluate thermal management solutions capable of dissipating up to 1.02 kW of power loss. Compare saturation voltage specifications against system efficiency requirements.

Part Context

This component belongs to Microchip's high-speed IGBT4 power module series. These modules are engineered for robust performance in industrial environments. The TFS-SP6C packaging provides standardized mounting interfaces. The product represents an evolution in silicon-based power switching technology within the Microchip portfolio.

Replacement Considerations

Consult official Microchip substitution guides for verified alternatives. Cross-reference electrical parameters such as voltage ratings and current capacities carefully. Verify package compatibility before attempting physical replacement.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

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Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

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Mode of Transportation

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Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.