APTGX300H170G

APTGX300H170G

$254.70
  • Description:PM-IGBT-TFS-SP6C
  • Series:-

SKU:36988e54bc6f Category: Brand:

  
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Product Detailed Parameters

  • Description:PM-IGBT-TFS-SP6C
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • IGBT Type:-
  • Configuration:Full Bridge
  • Vce(on) (Max) @ Vge, Ic:2V @ 15V, 300A
  • Input:Standard
  • NTC Thermistor:No
  • Operating Temperature:-40°C ~ 175°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:-
  • Voltage - Collector Emitter Breakdown (Max):1700 V
  • Current - Collector (Ic) (Max):385 A
  • Power - Max:1.034 kW
  • Current - Collector Cutoff (Max):25 µA
  • Input Capacitance (Cies) @ Vce:31300 pF @ 25 V

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APTGX300H170G

Overview

The APTGX300H170G is a silicon IGBT power module manufactured by Microchip Technology. It features a full bridge configuration within an SP3F screw-mount package. The device supports a maximum collector-emitter voltage of 1.7 kV and delivers a continuous collector current of 120 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 1.7 V, a gate-emitter leakage current of 150 nA, and a maximum power dissipation of 1.807 kW. The module operates reliably across a temperature range from -40°C to +175°C, with a maximum gate-emitter voltage rating of 20 V.

Feature Summary

  • Full bridge topology integrates multiple switching elements for efficient power conversion.
  • High thermal stability enables operation up to 175°C junction temperature.
  • Screw-mount design facilitates secure mechanical attachment to heatsinks.

Applications

  • Industrial motor drives
  • Uninterruptible power supplies (UPS)
  • Induction heating systems

Procurement Notes

Verify the specific datasheet revision and ordering suffixes directly with Microchip Technology or authorized distributors. Confirm RoHS compliance status and lead times through official channels before procurement. Ensure the component matches the required SP3F package dimensions for your application.

Selection Notes

Select this module for applications requiring high voltage isolation and robust thermal performance in compact spaces. The 1.7 kV rating suits medium-voltage industrial systems. Verify that the 120 A current capacity meets peak load requirements and that the SP3F footprint aligns with existing PCB or busbar designs.

Part Context

This component belongs to Microchip's APTGX series of high-performance IGBT modules. The series utilizes advanced trench gate technology to optimize switching losses and conduction characteristics. The SP3F package provides a standardized form factor for easy integration into various power electronic architectures.

Replacement Considerations

Direct replacements must match the 1.7 kV voltage rating, 120 A current capacity, and SP3F package type. Consider modules like the APTGX75H170T3G if lower current is acceptable, but verify pin compatibility and thermal resistance specifications carefully.

APTGX300H170GAPTGX300H170G
$254.70
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