APTGX450A120T6G

APTGX450A120T6G

$170.09
  • Description:PM-IGBT-TFS-SP6C
  • Series:-

SKU:354aa80fab8c Category: Brand:

  
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Product Detailed Parameters

  • Description:PM-IGBT-TFS-SP6C
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • IGBT Type:-
  • Configuration:Half Bridge
  • Vce(on) (Max) @ Vge, Ic:1.8V @ 15V, 450A
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 175°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:-
  • Voltage - Collector Emitter Breakdown (Max):1200 V
  • Current - Collector (Ic) (Max):605 A
  • Power - Max:1.456 kW
  • Current - Collector Cutoff (Max):36 µA
  • Input Capacitance (Cies) @ Vce:90000 pF @ 25 V

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APTGX450A120T6G

Overview

The APTGX450A120T6G is a high-power IGBT module manufactured by Microchip Technology, designed for demanding power conversion applications. It features a half-bridge configuration within the SP6C package, supporting a collector-emitter voltage of 1200V and a continuous collector current of 605A at 25°C. The module exhibits a typical saturation voltage of 1.8V and a maximum power dissipation of 1.456kW. Operating within a temperature range of -40°C to +125°C, it integrates an NTC thermistor for thermal monitoring and utilizes Trench 7 silicon technology.

Feature Summary

  • Integrates Trench 7 IGBT technology for optimized switching performance
  • Includes built-in NTC thermistor for precise thermal management
  • Utilizes SP6C chassis mount packaging for robust mechanical stability

Applications

  • Industrial motor drives
  • Uninterruptible power supplies (UPS)
  • High-frequency induction heating systems

Procurement Notes

Verify component authenticity through authorized Microchip distributors or certified partners. Confirm that the specific part number matches the required electrical specifications and package type. Request original manufacturer documentation to validate technical parameters. Ensure storage conditions comply with moisture sensitivity levels. Inspect terminals for physical integrity upon receipt.

Selection Notes

Select this module when high current capacity and fast switching are required in compact industrial environments. The SP6C form factor facilitates efficient heat sinking and chassis integration. Consider the integrated NTC sensor for simplified thermal protection circuitry design. Evaluate the 1200V rating against system voltage peaks to ensure adequate safety margins.

Part Context

This component belongs to Microchip's advanced IGBT module portfolio, leveraging proprietary Trench 7 silicon architecture. It represents a evolution in power density and efficiency for medium-to-high power applications. The SP6C series provides standardized mounting solutions for consistent thermal and electrical performance across various industrial platforms.

Replacement Considerations

Direct substitutes include the APTGX300A120T6G for lower current requirements and the APTGX450DU120T6G for dual configurations. Verify pin compatibility and thermal resistance values before substitution. Cross-reference datasheets to confirm equivalent switching characteristics and package dimensions.

APTGX450A120T6GAPTGX450A120T6G
$170.09
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