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Product Detailed Parameters
- Description：PM-IGBT-TFS-SP6LI
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：-
- Configuration：Half Bridge
- Vce(on) (Max) @ Vge, Ic：2V @ 15V, 450A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：1700 V
- Current - Collector (Ic) (Max)：805 A
- Power - Max：2.631 kW
- Current - Collector Cutoff (Max)：50 µA
- Input Capacitance (Cies) @ Vce：45600 pF @ 25 V
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Overview
The APTGX450A170T6LIAG is a high-power IGBT module manufactured by Microchip Technology, designed for demanding industrial and traction applications. It features a dual configuration within an SP6C package, supporting a collector-emitter voltage of 1700 V. The device delivers a continuous collector current of 450 A at 25°C with a saturated collector-emitter voltage of 2.3 V. It operates within a junction temperature range of -40°C to +175°C and has a maximum power dissipation of 2.8 kW. The module utilizes screw mount installation and silicon technology.
Feature Summary
- High-voltage capability suitable for medium-voltage drive systems
- Optimized switching characteristics for reduced system losses
- Robust thermal performance for high-power density designs
Applications
- Medium voltage variable frequency drives
- Industrial motor control inverters
- Uninterruptible power supply systems
Procurement Notes
Verify the specific suffix 'LIAG' against official Microchip documentation to confirm lead-free status and RoHS compliance details. Ensure the SP6C package dimensions match the target PCB layout requirements. Confirm that the gate threshold voltage aligns with the intended driver circuit specifications before finalizing procurement orders.
Selection Notes
Select this component for applications requiring high current handling and robust voltage blocking capabilities. Evaluate the thermal resistance characteristics to ensure adequate heatsinking solutions are implemented. Compare the switching energy losses against alternative modules to optimize overall system efficiency and cooling requirements.
Part Context
This module belongs to the APTG series of trench field-stop IGBTs from Microchip Technology. The series is engineered for high-efficiency power conversion in industrial environments. The SP6C packaging provides a standardized form factor for easy integration into existing inverter topologies and modular power systems.
Replacement Considerations
Direct replacements may include other 1700V 450A IGBT modules in similar packages. Verify pin compatibility and electrical parameters such as Vce(sat) and switching times. Consult Microchip's official substitution guides for qualified alternatives.
