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Product Detailed Parameters
- Description：MOSFET 6N-CH 100V 70A SP6-P
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- Technology：MOSFET (Metal Oxide)
- Configuration：6 N-Channel (3-Phase Bridge)
- FET Feature：-
- Drain to Source Voltage (Vdss)：100V
- Current - Continuous Drain (Id) @ 25°C：70A
- Rds On (Max) @ Id, Vgs：21mOhm @ 35A, 10V
- Vgs(th) (Max) @ Id：4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs：200nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：5100pF @ 25V
- Power - Max：208W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP6
- Supplier Device Package：SP6-P
- Grade：-
- Qualification：-
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Overview
The APTM10TAM19FPG is a silicon FREDFET MOSFET module manufactured by Microchip Technology. It features a triple phase leg configuration with six N-channel devices housed in an SP6-P chassis mount package. The component supports a drain-source voltage of 100V and provides a continuous drain current of 70A at 25°C. Typical on-resistance is 19mΩ, with a maximum gate charge of 350nC at 10V. Input capacitance reaches 9875pF at 25V. The unit operates within a junction temperature range of -40°C to 150°C and delivers a maximum power rating of 208W.
Feature Summary
- Integrates three-phase bridge architecture for compact power conversion designs
- Utilizes FREDFET technology for optimized switching performance
- Designed for robust chassis mounting applications
Applications
- Industrial motor drives
- Power supply inverters
- Chassis-mounted power modules
Procurement Notes
Verify the specific suffix FPG against official Microchip documentation to confirm package type and pinout compatibility. Ensure thermal management solutions align with the SP6-P chassis mount requirements. Confirm RoHS compliance status through the manufacturer's latest product change notifications before finalizing procurement specifications.
Selection Notes
Select this module when a pre-configured three-phase leg is required for 100V applications. Evaluate the 19mΩ typical on-resistance against system conduction loss targets. Consider the 70A continuous current rating relative to peak load demands. Verify that the SP6-P footprint matches the mechanical constraints of the target chassis design.
Part Context
This component belongs to the APTM series of discrete and power modules from Microchip Technology. It utilizes standard silicon technology rather than wide-bandgap materials. The part is categorized under MOSFET arrays and serves as a complete solution for multi-switch configurations, eliminating the need for individual device selection and parallel balancing.
Replacement Considerations
Consult official Microchip substitution guides for verified alternatives. Cross-reference parameters such as VDSS, ID, and RDS(on) carefully. No public substitute part numbers are confirmed in the provided data.
