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Product Detailed Parameters
- Description：MOSFET 2N-CH 1200V 34A SP4
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- Technology：MOSFET (Metal Oxide)
- Configuration：2 N-Channel (Half Bridge)
- FET Feature：-
- Drain to Source Voltage (Vdss)：1200V (1.2kV)
- Current - Continuous Drain (Id) @ 25°C：34A
- Rds On (Max) @ Id, Vgs：348mOhm @ 17A, 10V
- Vgs(th) (Max) @ Id：5V @ 5mA
- Gate Charge (Qg) (Max) @ Vgs：374nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：10300pF @ 25V
- Power - Max：780W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP4
- Supplier Device Package：SP4
- Grade：-
- Qualification：-
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Overview
The APTM120A29FTG is a power MOSFET module from Microchip Technology, utilizing FREDFET silicon technology. It features an N-channel configuration housed in the SP-4 package. The device supports a drain-source voltage of 1200V and operates with a continuous drain current of 25A at a case temperature of 80°C. The typical on-state resistance is 290 milliohms. It includes an integrated NTC thermistor for thermal monitoring and utilizes FASTON connectors for electrical mounting.
Feature Summary
- Integrates N-channel FREDFET silicon MOSFETs within a single module
- Includes built-in NTC thermistor for precise thermal management
- Designed for phase leg applications with robust chassis mounting capabilities
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- High-frequency switching power converters
Procurement Notes
Verify the specific ordering suffix to ensure compatibility with required packaging and lead times. Confirm that the SP-4 package dimensions match the target chassis design. Check for updated datasheet revisions to validate electrical characteristics against current system requirements before finalizing procurement decisions.
Selection Notes
Select this component when a 1200V rating and 25A continuous current are required in a compact form factor. The integrated NTC sensor simplifies thermal protection circuitry. Ensure the application can accommodate the FASTON connector interface and screw-mounting style inherent to the SP-4 package design.
Part Context
This module belongs to the PM-MOSFET-FREDFET-7-SP4 series by Microchip Technology. It represents a discrete power solution combining fast recovery diodes with MOSFETs. The SP-4 package provides a standardized footprint for high-power density designs requiring reliable thermal dissipation and electrical isolation.
Replacement Considerations
Consult official cross-reference lists for direct substitutes. Verify pinout compatibility and thermal resistance values when considering alternative modules from other manufacturers to ensure seamless integration without redesigning the cooling infrastructure.
