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The APTM20AM10STG is a Microchip Technology MOSFET module featuring two N-channel half-bridge configurations. It supports a drain-to-source voltage of 200V and a continuous drain current of 175A at 25°C. The device has a maximum on-resistance of 12 milliohms at 87.5A and 10V gate drive. Key electrical parameters include a maximum gate charge of 224nC, an input capacitance of 13700pF, and a power dissipation rating of 694W. The component operates within a junction temperature range of -40°C to 150°C and utilizes the SP4 chassis mount package.
Verify the specific suffix STG against official Microchip documentation to confirm package variant and pinout compatibility. Ensure that the selected module meets the required thermal interface specifications for the intended chassis mounting application. Cross-reference the datasheet revision history to confirm that no product change notifications affect the electrical parameters or mechanical dimensions prior to finalizing procurement orders.
Select this component when a 200V half-bridge configuration with high current capacity is required. Evaluate the 12 milliohm on-resistance against system conduction loss requirements. Confirm that the SP4 package dimensions align with the available chassis space. Consider the 694W power dissipation limit relative to the cooling solution efficiency and ambient operating conditions to ensure reliable thermal performance.
This part belongs to the APTM series of discrete semiconductor modules manufactured by Microchip Technology. The series typically includes various voltage and current ratings packaged in standardized formats like SP4. These modules are designed to replace older discrete component assemblies, offering improved reliability and simplified assembly for power electronics designers working with medium-voltage applications.
The APTM20AM10FTG is a documented alternative within the same product family. Verify that the FTG suffix denotes identical electrical characteristics and mechanical footprint before substitution. Review the specific datasheet for both parts to ensure no functional differences exist regarding gate drive requirements or thermal resistance values.