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Product Detailed Parameters
- Description：MOSFET 4N-CH 200V 89A SP4
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- Technology：MOSFET (Metal Oxide)
- Configuration：4 N-Channel (Full Bridge)
- FET Feature：-
- Drain to Source Voltage (Vdss)：200V
- Current - Continuous Drain (Id) @ 25°C：89A
- Rds On (Max) @ Id, Vgs：24mOhm @ 44.5A, 10V
- Vgs(th) (Max) @ Id：5V @ 2.5mA
- Gate Charge (Qg) (Max) @ Vgs：112nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：6850pF @ 25V
- Power - Max：357W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP4
- Supplier Device Package：SP4
- Grade：-
- Qualification：-
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Overview
The APTM20HM20FTG is a MOSFET module from Microchip Technology, classified under the PM-MOSFET-FREDFET-7-SP4 series. It features a half-bridge configuration with four power channels. The device supports a voltage rating of 200V and a continuous current of 89A. Peak repetitive current capability is specified at 356A. Thermal performance includes a maximum power dissipation of 357W. The component utilizes an SP4 chassis mount package for robust integration in high-power systems.
Feature Summary
- Half-bridge MOSFET array architecture
- High voltage and current handling capabilities
- Chassis mount packaging for thermal management
Applications
- High-performance power switching applications
- Industrial motor drives
- Power conversion systems
Procurement Notes
Verify the specific datasheet revision and ordering suffix to ensure compatibility with system requirements. Confirm that the SP4 package dimensions align with the mechanical design constraints. Check for any specific handling instructions related to the chassis mount interface. Ensure that the gate drive signals are compatible with the module's electrical characteristics before implementation.
Selection Notes
Select this module when a compact solution with high current density is required. The 200V rating suits medium-voltage applications. Consider the 357W dissipation limit for thermal design. The SP4 package offers a standardized mounting footprint. Evaluate the peak current capability against transient load conditions in the target application.
Part Context
This part belongs to Microchip's FREDFET-7 series, which integrates fast recovery diodes with MOSFETs. The SP4 designation indicates a specific multi-module package format designed for parallel operation or bridge configurations. This series targets efficiency improvements in power electronics by reducing parasitic inductances.
Replacement Considerations
Consult official substitution lists for equivalent modules within the same voltage and current class. Verify pinout compatibility and thermal resistance values when considering alternatives.
