APTM50DDA10T3G

Description：MOSFET 2N-CH 500V 37A SP3
Series：-

SKU:841b1b531094 Category: FET, MOSFET Arrays Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：MOSFET 2N-CH 500V 37A SP3
Series：-
Mfr：Microchip Technology
Package：Bulk
Technology：MOSFET (Metal Oxide)
Configuration：2 N-Channel (Dual)
FET Feature：-
Drain to Source Voltage (Vdss)：500V
Current - Continuous Drain (Id) @ 25°C：37A
Rds On (Max) @ Id, Vgs：120mOhm @ 18.5A, 10V
Vgs(th) (Max) @ Id：5V @ 1mA
Gate Charge (Qg) (Max) @ Vgs：96nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds：4367pF @ 25V
Power - Max：312W
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP3
Supplier Device Package：SP3
Grade：-
Qualification：-

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APTM50DDA10T3G

Overview

The APTM50DDA10T3G is a dual N-channel Power MOSFET module from Microchip Technology, housed in the SP-32 package. It features a drain-source breakdown voltage of 500 V and a continuous drain current of 37 A. The device has a maximum on-resistance of 10 mΩ per channel. Gate-source voltage limits are ±20 V. Operating temperature ranges from -40°C to +150°C junction temperature. Total power dissipation is rated at 208 W. The module utilizes screw mount installation for thermal management.

Feature Summary

Dual N-channel configuration within a single compact module
Low on-resistance for efficient conduction
High thermal performance with screw mount capability

Applications

Motor control drives
Power supply inverters
Industrial switching applications

Procurement Notes

Verify the specific suffix T3G against the official Microchip datasheet to confirm RoHS compliance and tape-and-reel packaging details. Ensure the SP-32 package dimensions match your PCB layout requirements. Confirm that the gate charge specifications align with your driver capabilities for optimal switching performance.

Selection Notes

Select this component when a dual N-channel solution is required for high-voltage applications up to 500 V. The low on-resistance makes it suitable for efficiency-critical designs. Consider the thermal resistance characteristics and ensure adequate heatsinking for the specified power dissipation levels in your application environment.

Part Context

This part belongs to the AP (Advanced Power) series of discrete and power modules by Microchip Technology. It is designed for robust performance in demanding power electronics environments. The SP-32 package provides a standardized form factor for integration into various industrial and commercial power systems.

Replacement Considerations

Consult official Microchip documentation for direct pin-compatible substitutes within the same voltage and current ratings. Verify electrical parameters such as Rds(on) and Qg before substitution to ensure circuit compatibility.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.