AS1170-ZWLM

Overview

The AS1170-ZWLM is a dual-channel LED and VCSEL driver IC manufactured by ams OSRAM. It integrates a DC-DC boost converter with independent channel control, supporting output currents of 1.8A and 2A per channel. The device operates within an input voltage range of 2.7V to 5.5V and delivers outputs between 2.8V and 5.5V. It features a fixed switching frequency of 4MHz and utilizes an I2C interface for configuration. Packaged in a 13-ball WLCSP measuring 2.25mm x 1.52mm, it functions across temperatures from -30°C to 85°C.

Feature Summary

• Integrates a high-efficiency 4 MHz fixed-frequency DC-DC boost converter
• Provides independent control for two channels or combined single-output mode
• Includes automatic battery runtime extension when input voltage drops
• Features integrated circuit protection mechanisms

Applications

• Smartphone camera flashlights and video lights
• 3D sensing systems including active stereo vision and structured light
• Robotics and factory automation equipment
• Residential and building automation systems
• Handheld barcode scanners

Procurement Notes

Verify the specific suffix ZWLM against the manufacturer datasheet to confirm package dimensions and tape/reel specifications. Ensure the design supports the required 4 MHz switching frequency and I2C communication lines. Confirm thermal management capabilities for the WLCSP package under maximum load conditions at elevated ambient temperatures up to 85°C.

Selection Notes

Select this component for applications requiring high current density in a minimal footprint. The integrated boost converter eliminates external inductors if space allows, though external components may be needed for optimal efficiency. Consider the 1.8A and 2A channel limits when sizing the LED or VCSEL load. Verify compatibility with the system's I2C bus speed and address configuration.

Part Context

This part belongs to the AS1170 series of dual-channel drivers designed for mobile and portable devices. It addresses the need for high brightness in compact form factors common in smartphones and wearable technology. The WLCSP packaging aligns with modern PCB space constraints, offering a cost-effective solution compared to larger QFN packages while maintaining robust electrical performance.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Users must consult the manufacturer directly for obsolescence notices or recommended alternatives within the same product family.