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AT17N256-10SI is listed in the Configuration PROMs For FPGAs range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 256K CONFIG MEM 20SOIC. Review the specifications below when checking this part for your BOM.
The AT17N256-10SI is a 3.3V FPGA Configuration EEPROM providing 256-Kbit storage capacity in a 20-lead SOIC package. Designed for industrial applications, it operates within a temperature range of -40°C to +85°C and supports a maximum clock frequency of 10 MHz. The device features a simple serial interface compatible with SRAM FPGAs like Xilinx Spartan-II and Spartan-IIE in Master Serial Mode. It utilizes a low-power CMOS EEPROM process with high reliability, including a minimum endurance of 10 write cycles and data retention of 20 years at 85°C.
Verify the component manufacturer, as this part originates from Atmel Corporation before its acquisition by Microchip Technology. Confirm that the specific ordering code matches the required industrial temperature range (-40°C to +85°C) and the 20-lead SOIC package type. Ensure compatibility with existing FPGA designs requiring pin-compatible replacements for legacy Xilinx OTP PROMs.
Select this component when designing systems using SRAM-based FPGAs that require serial configuration upon power-up. It is suitable for industrial environments requiring operation down to -40°C. Consider the 256-Kbit density limit and the 10 MHz maximum clock speed when determining if it meets the timing requirements of the target FPGA configuration process.
The AT17N series serves as a cost-effective configurator for FPGAs, bridging the gap between complex parallel configuration methods and simpler serial alternatives. This specific model represents the 256-Kbit density option within the series, offering a balance between storage capacity and package size for smaller FPGA configurations.
The datasheet indicates that the AT17N256 series has been replaced by the AT17LV256 series. Verify if the AT17LV256-10SI or similar variants are available as direct functional replacements for new designs.
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