SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
BAP50-04,215 is listed in the RF Diode range at ChipApex. The manufacturer field lists NXP Semiconductors. Its product description is RF DIODE PIN 50V 250MW SOT-23. Review the specifications below when checking this part for your BOM.
The BAP50-04 is a silicon PIN diode featuring two planar elements in series configuration, housed in an SOT23 small plastic surface-mounted device package. It provides low diode capacitance and low forward resistance for general RF applications. Key electrical characteristics include a maximum reverse voltage of 50 V and a maximum forward current of 50 mA. At 1 MHz with zero bias, the typical diode capacitance is 0.45 pF. The thermal resistance from junction to solder point is typically 220 K/W.
Verify the component against the official NXP Semiconductors data sheet (Rev. 3.1) to confirm authenticity and specifications. Ensure the marking code matches the datasheet requirements. Check that the package type corresponds to the SOT23 outline. Confirm compliance with relevant standards before integration into designs.
Select this component when a dual-element series PIN diode is required in a minimal footprint. Consider the 50 V reverse voltage rating and 50 mA forward current limits for circuit design. Evaluate the low capacitance values at specific bias voltages for RF performance requirements. Verify thermal management capabilities based on the junction-to-solder point resistance.
This part belongs to the BAP50 series of silicon PIN diodes manufactured by NXP Semiconductors. The series includes variants such as the BAP50-02 and BAP50-03, which offer different configurations or characteristics. The BAP50-04 specifically integrates two diodes in series, distinguishing it from single-diode counterparts in the same family.
Consult the manufacturer's documentation for officially confirmed substitute part numbers. Do not assume cross-compatibility with other series without verifying pinout, electrical ratings, and package dimensions against the original specification.
Pin 1 is the anode, Pin 2 is the cathode, and Pin 3 serves as the common connection.
The typical diode capacitance is 0.45 pF under these conditions.
The maximum total power dissipation is 250 mW when the solder point temperature is 90 °C or less.
Explore related parts through Diodes, Discrete Semiconductor Products, all product categories, ChipApex homepage.