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BAW56_R1_00001 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Panjit International Inc.. Its product description is DIODE ARRAY GP 75V 150MA SOT23. Review the specifications below when checking this part for your BOM.
The BAW56_R1_00001 is a small signal switching diode manufactured by Panjit International Inc. It utilizes silicon technology and is housed in an SOT-363-6 surface-mount package. The device features a common anode configuration with a peak reverse voltage rating of 100 V. It supports a maximum forward current of 150 mA and can withstand a surge current of 4 A. Key electrical characteristics include a forward voltage of 1.25 V, a reverse leakage current of 2.5 uA, and a rapid recovery time of 4 ns. The component operates within a temperature range of -55 C to +150 C.
Verify the specific suffix against official documentation to confirm pinout and packaging details. Confirm RoHS compliance status through the manufacturer's datasheet. Ensure the ordering quantity aligns with standard reel or cut-tape availability. Cross-reference the part number with authorized distributors to validate authenticity and supply chain integrity before procurement.
Select this component when a low-capacitance, fast-recovery solution is required for compact designs. The SOT-363 package suits space-constrained PCB layouts. Evaluate the 100 V reverse voltage limit against peak circuit voltages. Consider the 4 A surge capability for transient suppression needs. Verify thermal management requirements given the 150 C maximum junction temperature.
This part belongs to Panjit's portfolio of small signal switching diodes designed for general-purpose applications. It serves as a compact alternative to larger discrete diodes in modern electronics. The SOT-363 package allows for automated surface-mount assembly. It complements other Panjit diode series offering similar voltage and current ratings.
Check for direct equivalents from other manufacturers that match the 100 V rating, 150 mA current, and SOT-363 package. Verify compatibility of the common anode configuration and 4 ns recovery time. Ensure thermal and electrical specifications align with the original design requirements.
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