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BAW56H RFG is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Taiwan Semiconductor Corporation. Its product description is SOT-23, 100V, 0.215A, SWITCHING. Review the specifications below when checking this part for your BOM.
The BAW56H RFG is a dual common anode switching diode array manufactured by Taiwan Semiconductor Corporation. It features a maximum DC reverse voltage of 100 V and an average rectified forward current of 215 mA per diode. The device exhibits a fast reverse recovery time of 4 ns, suitable for high-speed applications. Forward voltage is specified at 1.25 V when conducting 150 mA, with a reverse leakage current of 500 nA at 75 V. It operates within a junction temperature range of -55°C to 150°C and is housed in a SOT-23 (TO-236-3) surface-mount package.
Verify the specific ordering suffix and manufacturer part number against official Taiwan Semiconductor documentation to ensure exact component matching. Confirm that the received devices align with the specified SOT-23 package and electrical parameters defined in the datasheet before integration into production lines.
Select this component when a dual common anode switching diode with automotive qualification is required. The 100 V rating and 215 mA current capacity suit low-power high-speed applications. Ensure the SOT-23 footprint matches the PCB layout constraints and that the 4 ns recovery time meets the system's speed requirements.
This part belongs to the BAW56 series of small signal switching diodes from Taiwan Semiconductor. It is designed for general-purpose applications where fast switching and compact packaging are essential. The automotive grade variant ensures compliance with industry standards for vehicle electronics, providing robust performance in demanding environments.
Check for direct substitutes such as the BAW56WH RFG, which shares similar electrical characteristics but utilizes a SOT-323 package. Verify pinout compatibility and thermal dissipation capabilities before substituting to ensure seamless integration without redesigning the printed circuit board.
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