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BC 857B B5003 is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is TRANS PNP 45V 0.1A PG-SOT23. Review the specifications below when checking this part for your BOM.
The BC857BB5003 is a PNP bipolar junction transistor manufactured by Infineon Technologies, belonging to the BC857 series. It features a single configuration in an SOT-23-3 surface-mount package. Key electrical parameters include a maximum collector-emitter voltage of 45 V and a continuous collector current of 100 mA. The device exhibits a DC current gain (hFE) range of 220 to 475 at a collector current of 2 mA. Additional specifications comprise a transition frequency of 250 MHz, a power dissipation of 330 mW, and an operating temperature range from -65 °C to +150 °C.
Verify component authenticity through authorized channels due to potential counterfeits. Confirm specific binning requirements for hFE ranges if precise gain matching is necessary for the design. Check RoHS compliance status and material content declarations prior to integration. Ensure storage conditions adhere to moisture sensitivity level guidelines to prevent package damage during soldering processes.
Select this component when a PNP transistor with moderate gain and high-frequency response is required in a compact surface-mount form factor. Consider the 45 V breakdown voltage and 100 mA current limits against circuit demands. Evaluate thermal management needs given the 330 mW power dissipation rating in the small SOT-23 package.
This part belongs to the BC857 family of general-purpose PNP transistors produced by Infineon Technologies. The series offers various gain bins to accommodate different circuit sensitivities. These devices are widely used in consumer electronics and industrial control systems where reliable low-power switching is essential.
Compatible substitutes include other BC857B variants from different manufacturers that meet the same electrical specifications and pinout configuration. Verify package dimensions and thermal characteristics before substitution.
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