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BC184L is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists onsemi. Its product description is TRANS NPN 30V 0.5A TO-92-3. Review the specifications below when checking this part for your BOM.
The BC184L is a silicon NPN small signal transistor manufactured by onsemi, formerly Fairchild Semiconductor. It features a collector-emitter voltage (VCEO) of 30 V and a DC collector current (IC) rating of 500 mA. The device provides a minimum DC current gain (hFE) of 130 at VCE = 5.0 V and IC = 100 mA. Key electrical characteristics include a collector-base breakdown voltage of 45 V, an emitter-base voltage of 5 V, and a maximum junction temperature of 150 °C. The component utilizes a TO-92 package.
Verify the manufacturer origin, as the datasheet indicates Fairchild Semiconductor while the brand is listed as onsemi due to acquisition. Confirm the specific revision status (Rev. A1) and ensure the component matches the TO-92 through-hole package dimensions provided in the official documentation. Cross-reference part numbers with authorized distributors to avoid counterfeit components.
Select this component when a standard NPN transistor with a 30 V collector-emitter voltage and 500 mA continuous current capacity is required. The high minimum hFE of 130 makes it suitable for applications demanding reliable amplification without excessive base drive current. Ensure the thermal environment allows for operation within the specified 150 °C junction temperature limit.
The BC184L belongs to the family of silicon NPN small signal transistors designed for low-power amplification and switching tasks. Originally produced by Fairchild Semiconductor, these devices are widely used in consumer electronics and industrial control systems where standard TO-92 packaging facilitates easy integration into printed circuit boards.
Compatible substitutes include the BC184B and BC184C, which share similar electrical characteristics but may differ in current gain selection groups. Verify that alternative parts meet the specific hFE requirements and package compatibility before implementation.
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