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The BC80740 is a PNP silicon planar medium power transistor manufactured by Fairchild Semiconductor. It operates with a maximum collector-emitter voltage of 45 V and a continuous collector current of 0.8 A. The device utilizes an SOT-23 surface-mount package, specifically identified as R-PDSO-G3 in regulatory documentation. Key electrical characteristics include a minimum DC current gain (hFE) of 170 and a maximum operating temperature of 150 °C. The component is lead-free compliant and classified under EAR99.
Verify the manufacturer origin carefully, as the BC80740MTF designation appears in databases linked to both ON Semiconductor and Fairchild Semiconductor. Confirm the specific datasheet version matches the required hFE binning and package marking. Ensure compliance with RoHS and lead-free requirements if specified for the target assembly process. Cross-reference the ordering suffix to confirm exact packaging and reel specifications.
Select this component when a high-current PNP transistor is required in a compact SOT-23 footprint. The 0.8 A rating exceeds standard general-purpose BJT limits, making it suitable for moderate load driving. Verify that the 45 V breakdown voltage aligns with the circuit's supply rails. Consider the complementary BC817 series for matched NPN/PNP pairs in differential or push-pull configurations.
The BC80740 belongs to the broader BC807 family of PNP general-purpose transistors produced by Fairchild Semiconductor. This family shares common packaging standards but varies in current gain bins and specific current ratings. The BC80740 represents a higher current variant compared to lower-rated siblings, offering enhanced performance for audio and power switching tasks while maintaining compatibility with standard SOT-23 footprints.
Direct substitutes include other manufacturers' BC807-40 variants, such as those from Nexperia or Diodes Incorporated, provided they meet the 0.8 A current and 45 V voltage specifications. Ensure pinout compatibility (Emitter, Base, Collector) remains consistent across the SOT-23 package to avoid board redesign.