ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IC
- Series：-
- Mfr：Diodes Incorporated
- Package：Tape & Reel (TR)
- Transistor Type：NPN
- Current - Collector (Ic) (Max)：500 mA
- Voltage - Collector Emitter Breakdown (Max)：45 V
- Vce Saturation (Max) @ Ib, Ic：700mV @ 50mA, 500mA
- Current - Collector Cutoff (Max)：100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce：250 @ 100mA, 1V
- Power - Max：500 mW
- Frequency - Transition：100MHz
- Operating Temperature：-55°C ~ 150°C (TJ)
- Mounting Type：Surface Mount, Wettable Flank
- Package / Case：3-UDFN
- Supplier Device Package：U-DFN1412-3/SWP (Type A)
- Grade：Automotive
- Qualification：AEC-Q101
Download product information
Overview
The BC817-40FSWQ-7 is an NPN small-signal BJT in a U-DFN1412-3 package. It features a collector-emitter voltage (VCEO) of 45 V, continuous collector current (IC) of 500 mA, and peak pulse current (ICM) of 1 A. Power dissipation is 500 mW at 25°C ambient on standard FR4, rising to 1.25 W with optimized copper pads. DC current gain (hFE) ranges from 250 to 600 at IC = 100 mA. Transition frequency (fT) is 100 MHz. ESD ratings are 4000 V HBM and 1000 V CDM.
Feature Summary
- AEC-Q101 qualified for automotive applications with PPAP capability
- Low-profile 0.6 mm height package suitable for thin designs
- Sidewall tin plating enables wettable flanks for AOI inspection
Applications
- General-purpose switching
- Amplification circuits
- Automotive electronics requiring specific change control
Procurement Notes
Verify the complete part number including the -7 suffix against Diodes Incorporated documentation to ensure correct reel size and tape width specifications. Confirm that the U-DFN1412-3/SWP package variant matches the required footprint dimensions and pad layout for the target PCB design before finalizing procurement orders.
Selection Notes
Select this component when automotive reliability standards such as AEC-Q101 and IATF16949 manufacturing processes are mandatory. The low-profile form factor makes it appropriate for space-constrained layouts where traditional SOT-23 packages exceed height restrictions. Ensure thermal management strategies account for the 500 mW dissipation limit on standard single-sided FR4 substrates.
Part Context
This device belongs to the BC817-xxFSWQ series manufactured by Diodes Incorporated. It serves as the NPN counterpart to the BC807-40FSWQ PNP transistor. The family shares identical mechanical dimensions and pinout configurations, differing primarily in their specified DC current gain bands to accommodate various amplification requirements.
Replacement Considerations
BC817-40FSWQ
FAQ
What is the maximum power dissipation rating?
The maximum power dissipation is 500 mW when mounted on a minimum recommended pad layout on a single-sided 1.6mm FR4 PCB. It increases to 1.25 W if mounted with a 1-inch square pad using 2oz copper.
How does the package support automated optical inspection?
The U-DFN1412-3/SWP package features sidewall tin plating, which creates wettable flanks. This design characteristic allows solder joints to be visually verified during Automated Optical Inspection (AOI).
What are the electrostatic discharge protection levels?
The device provides 4000 V protection under the Human Body Model (JEDEC Class 3A) and 1000 V protection under the Charged Device Model (JEDEC Class C3).
