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The BC817SUE6327HTSA1 is a single NPN silicon bipolar junction transistor manufactured by Infineon Technologies. It is housed in a PG-SC74-6 surface-mount package and supports continuous collector currents up to 500 mA with a maximum power dissipation of 1 W. The device features a collector-emitter voltage rating of 45 V, a collector-base voltage of 50 V, and an emitter-base voltage of 5 V. It exhibits a transition frequency of 170 MHz and operates within a temperature range of -65°C to +150°C. The component is qualified under AEC-Q100 standards for automotive applications.
Verify the specific suffix configuration against official Infineon documentation to ensure compatibility with design requirements. Confirm that the PG-SC74-6 package dimensions align with PCB footprint specifications. Check current lifecycle status as older variants may be subject to obsolescence notices. Ensure supply chain sources are authorized distributors to guarantee authenticity and traceability of the semiconductor material.
Select this component when high thermal performance is required in a small form factor. The 1 W dissipation rating distinguishes it from lower-power SOT-23 alternatives. Consider the AEC-Q100 qualification if the application demands automotive-grade robustness. Evaluate the 170 MHz bandwidth to ensure suitability for the intended signal frequencies. Verify that the 45 V voltage rating meets the circuit's maximum operational limits.
This part belongs to the BC817 series of NPN transistors, designed for general-purpose amplification and switching. The SUE variant specifically denotes the PG-SC74-6 package, offering enhanced thermal characteristics compared to standard SMD packages. It complements other series members like the BC817K and BC817UPN, which utilize different packaging solutions such as SOT-23-3 and SC-74-6 respectively, catering to diverse space and thermal constraints.
Direct substitutes include BC817SUT and BC817SUP, which share identical electrical parameters and the PG-SC74-6 package. Cross-reference pinout configurations to ensure compatibility during board-level replacement.